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公开(公告)号：US20190304805A1
公开(公告)日：2019-10-03
申请号：US15941809
申请日：2018-03-30
Applicant: Intel Corporation
Inventor： Jiongxin Lu , Aravindha Antoniswamy , Jinlin Wang , Ashutosh Srivastava
IPC: H01L21/48 , H01L23/498
Abstract: An electronic package including a substrate. The substrate includes a first solder material that is applied adjacent a periphery of the substrate. The substrate also includes a second solder material having properties different than the first solder material that is applied adjacent a periphery of a keep in zone of the substrate.
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