公开(公告)号：US20200098665A1

公开(公告)日：2020-03-26

申请号：US16143373

申请日：2018-09-26

Applicant: Intel Corporation

Inventor： Brian S. Jarrett ,  Joseph Andrew Broderick ,  Juan Gabriel Cevallos Palomeque

IPC: H01L23/427 ,  H01L21/48

Abstract: Embodiments may relate a computing device with a heat source. The computing device may have a heatsink physically and thermally coupled with the heat source. The heatsink may include a structural element internal to the heatsink. The structural element may cause a surface of the heatsink to deform to a non-planar configuration when the heatsink is coupled to the heat source. Other embodiments may be described or claimed.

公开(公告)号：US20160286694A1

公开(公告)日：2016-09-29

申请号：US14668331

申请日：2015-03-25

Applicant: Intel Corporation

Inventor： Shankar Krishnan ,  Richard C. Stamey ,  Brian S. Jarrett ,  Geoffrey G. Von Allmen

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H01L23/44 ,  H05K7/20236 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/203 ,  H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

Abstract: Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed.

Abstract translation: 本文公开了与冷却电子设备的一个或多个发热部件相关联的装置，方法和存储介质。 在实施例中，电子设备可以包括可以包括介电流体和一个或多个发热部件的罐。 电子设备还可以包括与罐相耦合的一个或多个换能器。 换能器可以被配置为产生超声波，其控制介质流体在罐内的位置的运动。 可以描述和/或要求保护其他实施例。

公开(公告)号：US11817371B2

公开(公告)日：2023-11-14

申请号：US16143373

申请日：2018-09-26

Applicant: Intel Corporation

Inventor： Brian S. Jarrett ,  Joseph Andrew Broderick ,  Juan Gabriel Cevallos Palomeque

IPC: H01L23/427 ,  H01L21/48

CPC classification number: H01L23/427 ,  H01L21/4882

Abstract: Semiconductor packages including a computing device with a heat source, and related devices and methods, are disclosed herein. For example, the computing device may have a heatsink physically and thermally coupled with the heat source. The heatsink may include a structural element internal to the heatsink. The structural element may cause a surface of the heatsink to deform to a non-planar configuration when the heatsink is coupled to the heat source.

公开(公告)号：US20170071079A1

公开(公告)日：2017-03-09

申请号：US15356873

申请日：2016-11-21

Applicant: Intel Corporation

Inventor： Shankar Krishnan ,  Richard C. Stamey ,  Brian S. Jarrett ,  Geoffrey G. Von Allmen

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H01L23/44 ,  H05K7/20236 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/203 ,  H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

Abstract: Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed.

Abstract translation: 本文公开了与冷却电子设备的一个或多个发热部件相关联的装置，方法和存储介质。 在实施例中，电子设备可以包括可以包括介电流体和一个或多个发热部件的罐。 电子设备还可以包括与罐相耦合的一个或多个换能器。 换能器可以被配置为产生超声波，其控制介质流体在罐内的位置的运动。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09516792B2

公开(公告)日：2016-12-06

申请号：US14668331

申请日：2015-03-25

Applicant: Intel Corporation

Inventor： Shankar Krishnan ,  Richard C. Stamey ,  Brian S. Jarrett ,  Geoffrey G. Von Allmen

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20836 ,  H01L23/44 ,  H05K7/20236 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/203 ,  H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

Abstract: Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed.

Abstract translation: 本文公开了与冷却电子设备的一个或多个发热部件相关联的装置，方法和存储介质。 在实施例中，电子设备可以包括可以包括介电流体和一个或多个发热部件的罐。 电子设备还可以包括与罐相耦合的一个或多个换能器。 换能器可以被配置为产生超声波，其控制介质流体在罐内的位置的运动。 可以描述和/或要求保护其他实施例。