公开(公告)号：US20190045661A1

公开(公告)日：2019-02-07

申请号：US15960127

申请日：2018-04-23

申请人： Intel Corporation

发明人： Joseph Andrew Broderick ,  Barrett M. Faneuf ,  Eric D. McAfee ,  Juan G. Cevallos ,  Jaime A. Sanchez ,  Emery E. Frey

IPC分类号： H05K7/20 ,  H05K7/14 ,  H05K7/02 ,  H05K1/02

摘要： Embodiments described herein may include apparatuses, systems and/or processes to encapsulate a circuit board to be cooled with a liquid coolant, that includes a first part dimensioned to receive the circuit board coupled with one or more heat sinks; a second part dimensioned to mate with the first part, and with a portion of a side of the circuit board around the one or more heat sinks to create a volume surrounding the circuit board, with a portion of the one or more heat sinks are outside the volume and is to be exposed to the liquid coolant, and a sealer to seal areas where the second part mates with the first part and the portion of the side of the circuit board, to prevent the liquid coolant from entering the volume. Other embodiments may be described and/or claimed.

公开(公告)号：US11184997B2

公开(公告)日：2021-11-23

申请号：US15960127

申请日：2018-04-23

申请人： Intel Corporation

发明人： Joseph Andrew Broderick ,  Barrett M. Faneuf ,  Eric D. McAfee ,  Juan G. Cevallos ,  Jaime A. Sanchez ,  Emery E. Frey

IPC分类号： H05K7/20 ,  H05K7/14 ,  H05K1/02 ,  H05K7/02

摘要： Embodiments described herein may include apparatuses, systems and/or processes to encapsulate a circuit board to be cooled with a liquid coolant, that includes a first part dimensioned to receive the circuit board coupled with one or more heat sinks; a second part dimensioned to mate with the first part, and with a portion of a side of the circuit board around the one or more heat sinks to create a volume surrounding the circuit board, with a portion of the one or more heat sinks are outside the volume and is to be exposed to the liquid coolant, and a sealer to seal areas where the second part mates with the first part and the portion of the side of the circuit board, to prevent the liquid coolant from entering the volume. Other embodiments may be described and/or claimed.

公开(公告)号：US20200098665A1

公开(公告)日：2020-03-26

申请号：US16143373

申请日：2018-09-26

申请人： Intel Corporation

发明人： Brian S. Jarrett ,  Joseph Andrew Broderick ,  Juan Gabriel Cevallos Palomeque

IPC分类号： H01L23/427 ,  H01L21/48

摘要： Embodiments may relate a computing device with a heat source. The computing device may have a heatsink physically and thermally coupled with the heat source. The heatsink may include a structural element internal to the heatsink. The structural element may cause a surface of the heatsink to deform to a non-planar configuration when the heatsink is coupled to the heat source. Other embodiments may be described or claimed.

公开(公告)号：US10945353B2

公开(公告)日：2021-03-09

申请号：US15711468

申请日：2017-09-21

申请人： Intel Corporation

发明人： Barrett M. Faneuf ,  Annie Chen ,  Jessica Gulbrand ,  Devdatta P. Kulkarni ,  Kristin L. Weldon ,  Joseph Andrew Broderick

IPC分类号： H05K7/20 ,  H05K1/02 ,  H01L23/44 ,  H05K3/22 ,  H05K1/18

摘要： Embodiments described herein may include apparatuses, systems and/or processes to provide a mechanism with a folded wrapping to mate with a circuit board and a heatsink to enclose and seal a volume between the circuit board and the heatsink. The mechanism with the folded wrapping may be dimensioned to enclose and seal the volume with the volume having a size to accommodate one or more processors to be disposed within the volume, electrically coupled to the circuit board and thermally coupled to the heatsink. On enclosing and sealing the volume, the mechanism with the folded wrapping may keep coolant from reaching the one or more processors when the circuit board, the mechanism, and the heatsink are immersed in the coolant. Other embodiments may be described and/or claimed.

公开(公告)号：US11817371B2

公开(公告)日：2023-11-14

申请号：US16143373

申请日：2018-09-26

申请人： Intel Corporation

发明人： Brian S. Jarrett ,  Joseph Andrew Broderick ,  Juan Gabriel Cevallos Palomeque

IPC分类号： H01L23/427 ,  H01L21/48

CPC分类号： H01L23/427 ,  H01L21/4882

摘要： Semiconductor packages including a computing device with a heat source, and related devices and methods, are disclosed herein. For example, the computing device may have a heatsink physically and thermally coupled with the heat source. The heatsink may include a structural element internal to the heatsink. The structural element may cause a surface of the heatsink to deform to a non-planar configuration when the heatsink is coupled to the heat source.