公开(公告)号：US20240405459A1

公开(公告)日：2024-12-05

申请号：US18327100

申请日：2023-06-01

Applicant: Intel Corporation

Inventor： Navneet K. SINGH ,  Aiswarya PIOUS ,  Samarth ALVA ,  Sharvil DESAI ,  Ralph JENSEN ,  Carlos MARISCAL ,  Michael CROCKER ,  Kevin MA ,  Pedro Jose MARTINEZ NARVAEZ

IPC: H01R12/52 ,  H05K3/36

Abstract: According to the various aspects, the present disclosure is directed to printed circuit board assemblies having a plurality of printed circuit board units or modules that use board connectors for joining the printed circuit board units. In an aspect, the board connector has a first surface, which may be a top surface, and an opposing second surface, which may be a bottom surface, and a plurality of openings, including a first set of connector openings for providing electrical connections between the at least two plurality of printed circuit board units. In another aspect, a method that includes forming a first printed circuit board unit with a first connecting portion and a second printed circuit board unit with a second connecting portion, and the first and second connecting are electrically coupled with the printed circuit board connector.