公开(公告)号：US20240063203A1

公开(公告)日：2024-02-22

申请号：US17889962

申请日：2022-08-17

Applicant: Intel Corporation

Inventor： Brandon C. MARIN ,  Ravindranath V. MAHAJAN ,  Srinivas V. PIETAMBARAM ,  Gang DUAN ,  Suddhasattwa NAD ,  Jeremy D. ECTON ,  Navneet SINGH ,  Sushil PADMANABHAN ,  Samarth ALVA

IPC: H01L25/18 ,  H01L23/15 ,  H01L23/538 ,  H01L23/48 ,  H01L21/48 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L25/18 ,  H01L23/15 ,  H01L23/5383 ,  H01L23/481 ,  H01L23/5384 ,  H01L21/486 ,  H01L21/4857 ,  H01L25/50 ,  H01L21/56

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a substrate, where the substrate comprises glass, and buildup layers over the first substrate. In an embodiment, a first die is over the buildup layers, a second die is over the buildup layers and adjacent to the first die, and where conductive routing in the buildup layers electrically couples the first die to the second die.

公开(公告)号：US20230251629A1

公开(公告)日：2023-08-10

申请号：US17667551

申请日：2022-02-09

Applicant: Intel Corporation

Inventor： Navneet SINGH ,  Samarth ALVA ,  Amarjeet KUMAR ,  Gaurav HADA

IPC: G05B19/4155

CPC classification number: G05B19/4155 ,  G05B2219/40269 ,  G05B2219/45031

Abstract: An apparatus includes a memory interposer including a socket including an inner surface, one or more memories disposed on the inner surface, a bottom surface opposite to the inner surface, and pogo pins disposed on the bottom surface and respectively corresponding to the one or more memories, the pogo pins being configured to connect the one or more memories to a printed circuit board (PCB) including a semiconductor die. The apparatus further includes an intermediate thermal head attached to the memory interposer. The memory interposer is movable with respect to the intermediate thermal head.

公开(公告)号：US20240405459A1

公开(公告)日：2024-12-05

申请号：US18327100

申请日：2023-06-01

Applicant: Intel Corporation

Inventor： Navneet K. SINGH ,  Aiswarya PIOUS ,  Samarth ALVA ,  Sharvil DESAI ,  Ralph JENSEN ,  Carlos MARISCAL ,  Michael CROCKER ,  Kevin MA ,  Pedro Jose MARTINEZ NARVAEZ

IPC: H01R12/52 ,  H05K3/36

Abstract: According to the various aspects, the present disclosure is directed to printed circuit board assemblies having a plurality of printed circuit board units or modules that use board connectors for joining the printed circuit board units. In an aspect, the board connector has a first surface, which may be a top surface, and an opposing second surface, which may be a bottom surface, and a plurality of openings, including a first set of connector openings for providing electrical connections between the at least two plurality of printed circuit board units. In another aspect, a method that includes forming a first printed circuit board unit with a first connecting portion and a second printed circuit board unit with a second connecting portion, and the first and second connecting are electrically coupled with the printed circuit board connector.

公开(公告)号：US20230299516A1

公开(公告)日：2023-09-21

申请号：US18202194

申请日：2023-05-25

Applicant: Intel Corporation

Inventor： Amarjeet KUMAR ,  Navneet Kumar SINGH, I ,  Samarth ALVA ,  Richard S. PERRY ,  Christopher WEST

IPC: H01R12/52 ,  H05K7/20

CPC classification number: H01R12/52 ,  H05K7/20509

Abstract: A back-to-back ultra-slim module (USM) includes an inline USM (USMi) connector and a top mount USM (USMt) connector. The back-to-back USM assembly can be made as a double-sided module to allow a stacked module configuration to save system area. The stacked module has a USMi module inline with the system board on one side of the system board, and a USMt module vertically offset from the other side of the system board. The stacked module can have a thermal layer between the USMi module and the USMt module.

公开(公告)号：US20210235603A1

公开(公告)日：2021-07-29

申请号：US17186092

申请日：2021-02-26

Applicant: Intel Corporation

Inventor： Justin HUTTULA ,  Bala SUBRAMANYA ,  Juha PAAVOLA ,  Mark CARBONE ,  Todd SMITH ,  Kari MANSUKOSKI ,  Samarth ALVA ,  Satyajit Siddharay KAMAT ,  Nagaraj K

IPC: H05K9/00 ,  H05K7/20

Abstract: A circuit board and vapor chamber are disclosed. Connectors couple the vapor chamber to a circuit board. The connectors extend from the bottom of the vapor chamber. The connectors fix the vapor chamber to the circuit board such that the bottom of the vapor chamber thermally couples to a heat source on the circuit board. The circuit board has a connector assembly that couples to the vapor chamber.