公开(公告)号：US20220078911A1

公开(公告)日：2022-03-10

申请号：US17090911

申请日：2020-11-06

Applicant: Intel Corporation

Inventor： Tin Poay CHUAH ,  Min Suet LIM ,  Chee Chun YEE ,  Yew San LIM ,  Eng Huat GOH

IPC: H05K1/11 ,  H05K1/14

Abstract: A multilayer printed circuit board including a first printed circuit board portion, including a first inserting connector, including a plurality of contacts for creating a first removable bus connection; a second printed circuit board portion, including a second inserting connector, including a plurality of contacts for creating a second removable bus connection; a third printed circuit board portion, connected between the first printed circuit board portion and to the second printed circuit board portion, wherein a rigidity of the third printed circuit board portion is less than a rigidity of each of the first printed circuit board portion and the second printed circuit board portion; wherein the multilayer printed circuit board is foldable along the third printed circuit board portion and, if so folded, the first printed circuit board portion is arranged on top of the second printed circuit board portion.

公开(公告)号：US20220066506A1

公开(公告)日：2022-03-03

申请号：US17088611

申请日：2020-11-04

Applicant: Intel Corporation

Inventor： Jeff KU ,  Tin Poay CHUAH ,  Yew San LIM ,  Min Suet LIM ,  Chee Chun YEE

IPC: G06F1/16 ,  G06F13/42 ,  G06F1/20 ,  H05K7/20

Abstract: The present disclosure relates to a docking station including a triangular prism shaped body, and a cradle proximal to a top section of the triangular prism shaped body for detachably receiving a mobile device, wherein the cradle may include a plurality of different connection interfaces to provide a selectable connection with a complementary connection interface of the mobile device.

公开(公告)号：US20220075410A1

公开(公告)日：2022-03-10

申请号：US17089752

申请日：2020-11-05

Applicant: Intel Corporation

Inventor： Min Suet LIM ,  Chee Chun YEE ,  Yew San LIM ,  Jeff KU ,  Tin Poay CHUAH

IPC: G06F1/16 ,  H05K7/20 ,  G06F1/20

Abstract: According to the present disclosure, a laptop may be provided with a smaller z-height using a motherboard assembly, including a motherboard having a plurality of components coupled thereon, a thermal transfer unit coupled to one or more component on the motherboard and attachment members for holding the motherboard in a lower compartment of a laptop clamshell casing at an inclining position.

公开(公告)号：US20220066509A1

公开(公告)日：2022-03-03

申请号：US17088620

申请日：2020-11-04

Applicant: Intel Corporation

Inventor： Chee Chun YEE ,  Tin Poay CHUAH ,  Yew San LIM ,  Min Suet LIM ,  Jeff KU

IPC: G06F1/16

Abstract: According to the various examples, a dual display system having a first panel having a first display area, a second panel having a second display area, and a connector assembly, attached to the first and second panels, that is configured to enable the first and second panels to rotate around three-directional axes. The connector assembly includes an elongated member and a hinge assembly, which are configured for attachment to the first and second display panels. The present dual display system may have several functional modalities, including use as a desktop computer, a laptop computer, a tablet, and a panoramic display.