公开(公告)号：US20250112200A1

公开(公告)日：2025-04-03

申请号：US18374559

申请日：2023-09-28

Applicant: Intel Corporation

Inventor： Adel Elsherbini ,  Kimin Jun ,  Feras Eid ,  Thomas Sounart ,  Yi Shi ,  Shawna Liff ,  Johanna Swan ,  Michael Baker ,  Bhaskar Jyoti Krishnatreya ,  Chien-An Chen

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065

Abstract: A surface of an integrated circuit (IC) die structure and a substrate to which the IC die structure is to be bonded include biphilic regions suitable for liquid droplet formation and droplet-based fine alignment of the IC die structure to the substrate. To ensure warpage of the IC die structure does not interfere with droplet-based fine alignment process, an IC die structure of greater thickness is aligned to the substrate and thickness of the IC die structure subsequently reduced. In some embodiments, a back side of the IC die structure is polished back post attachment. In some alternative embodiments, the IC die structure includes sacrificial die-level carrier is removed after fine alignment and/or bonding.