公开(公告)号：US20240068572A1

公开(公告)日：2024-02-29

申请号：US17895104

申请日：2022-08-25

Applicant: Intel Corporation

Inventor： Paul DIGLIO ,  Craig YOST ,  Christopher Wade ACKERMAN

IPC: F16J15/328

CPC classification number: F16J15/328

Abstract: The present disclosure is directed to a system having a first loading component and a second loading component for applying load to a device during a test of the device, the first loading component is configured to be moveable with respect to the second loading component. The system includes a seal member arranged between the first loading component and the second loading component, the seal member is adapted to engage the device diming testing so as to apply a load against the device during testing and provide sealing around a cavity positioned below the first loading component and above the device.

公开(公告)号：US20230288480A1

公开(公告)日：2023-09-14

申请号：US17692248

申请日：2022-03-11

Applicant: Intel Corporation

Inventor： Mahesh DESHMANE ,  Shoujie HE ,  Christopher Wade ACKERMAN ,  Jacob HALES ,  Johnny MATA VEGA ,  Joseph ZEARING

IPC: G01R31/319 ,  G01R31/317 ,  G01R31/28

CPC classification number: G01R31/31905 ,  G01R31/31917 ,  G01R31/31721 ,  G01R31/2874

Abstract: An apparatus includes a processor configured to control an automatic test equipment (ATE) to measure one or more parameters of a current test instance for testing a device under test (DUT), during execution of the current test instance on the DUT, and determine, based on the measured one or more parameters, one or more controls for controlling a temperature of a thermal head connected to the DUT so that a junction temperature of the DUT corresponds to a predetermined test temperature. The processor is further configured to control the temperature of the thermal head, based on the determined one or more controls.