公开(公告)号：US20190045462A1

公开(公告)日：2019-02-07

申请号：US16143730

申请日：2018-09-27

Applicant: Intel Corporation

Inventor： Ilan Sutskover ,  Wilfrid D'Angelo ,  Eran Friedlander ,  Nadav Kahana ,  Noam Kogos ,  Baruch Navon ,  Leor Rom

IPC: H04W52/36 ,  H03K19/094

Abstract: An embodiment of a semiconductor package apparatus may include technology to determine declared antenna gain-related information that corresponds to an estimated actual antenna gain for an antenna, and adjust a parameter of a wireless subsystem based on the declared antenna gain-related information. Other embodiments are disclosed and claimed.

公开(公告)号：US12144042B2

公开(公告)日：2024-11-12

申请号：US17128243

申请日：2020-12-21

Applicant: Intel Corporation

Inventor： Eytan Mann ,  Eran Friedlander ,  Idan Zalitzky ,  Guy Halperin

IPC: H04W76/15 ,  H04W84/12 ,  H04W88/10 ,  H04W92/10 ,  H04W92/20

Abstract: Devices and methods presented in this disclosure provide a single-channel WLAN device with a small add-on in the form of a second digital interface component and switch circuitry to allow for two such WLAN devices to be cascaded to support dual-channel WLAN operations. The WLAN device may include a first digital interface component including a first digital interface terminal configured for communicating with a first device external to the WLAN device; a second digital interface component including a second digital interface terminal configured for communicating with a second device external to the WLAN device; a switch circuitry coupling the first digital interface component to the second digital interface component and to a WLAN modem; and the WLAN modem configured to operate in one or more frequency bands and including one or more terminals configured to be coupled with a RF front end (FE) circuitry.

公开(公告)号：US10588097B2

公开(公告)日：2020-03-10

申请号：US16143730

申请日：2018-09-27

Applicant: Intel Corporation

Inventor： Ilan Sutskover ,  Wilfrid D'Angelo ,  Eran Friedlander ,  Nadav Kahana ,  Noam Kogos ,  Baruch Navon ,  Leor Rom

IPC: H04W52/36 ,  H04W52/00 ,  H03K19/094 ,  H04B17/13

Abstract: An embodiment of a semiconductor package apparatus may include technology to determine declared antenna gain-related information that corresponds to an estimated actual antenna gain for an antenna, and adjust a parameter of a wireless subsystem based on the declared antenna gain-related information. Other embodiments are disclosed and claimed.