公开(公告)号：US20190394876A1

公开(公告)日：2019-12-26

申请号：US16559286

申请日：2019-09-03

Applicant: Intel Corporation

Inventor： Zhichao ZHANG ,  Tao WU ,  Gaurav CHAWLA ,  Jeffrey LEE

IPC: H05K1/11

Abstract: A land grid array (LGA) land pad having reduced capacitance is disclosed. The conductive portion of a land pad that overlaps a parallel ground plane within the substrate is reduced by one or more non-conductive voids though the thickness of the conductive portion of the land pad. The voids may allow the contact area of the land pad, as defined by the perimeter of the land pad, to remain the same while reducing the conductive portion that overlaps the parallel ground plane. Capacitance between the land pad and the parallel ground plane is reduced by an amount proportional to the reduction in overlapping conductive area.

公开(公告)号：US20200065263A1

公开(公告)日：2020-02-27

申请号：US15746792

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Shawna LIFF ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Sasha N. OSTER ,  Gaurav CHAWLA

IPC: G06F13/14 ,  G02B6/42 ,  H04M9/06 ,  H01P5/00 ,  H01Q13/10 ,  H04B1/40 ,  H04B7/00

Abstract: Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.

公开(公告)号：US20210041647A1

公开(公告)日：2021-02-11

申请号：US17083173

申请日：2020-10-28

Applicant: Intel Corporation

Inventor： Shawna LIFF ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Sasha N. OSTER ,  Gaurav CHAWLA

IPC: G02B6/42

Abstract: Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.