公开(公告)号：US20210120665A1

公开(公告)日：2021-04-22

申请号：US17133113

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Jaejin Lee ,  Isaac Simpson ,  Dong-Ho Han ,  Jose Salazar Delgado ,  Arturo Navarro Alvarez

IPC: H05K1/02

Abstract: Electromagnetic interference (EMI) shields having attenuation interfaces are disclosed. A disclosed example EMI shield includes side walls defining sides of the EMI shield, and an attenuation interface to be placed into contact with a circuit board. The attenuation interface includes an inner perimeter having an EMI absorber and an outer perimeter having a metal backing to at least partially surround the EMI absorber.

公开(公告)号：US12133322B2

公开(公告)日：2024-10-29

申请号：US17133113

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Jaejin Lee ,  Isaac Simpson ,  Dong-Ho Han ,  Jose Salazar Delgado ,  Arturo Navarro Alvarez

IPC: H05K1/02

CPC classification number: H05K1/0225 ,  H05K1/0298 ,  H05K2201/093

Abstract: Electromagnetic interference (EMI) shields having attenuation interfaces are disclosed. A disclosed example EMI shield includes side walls defining sides of the EMI shield, and an attenuation interface to be placed into contact with a circuit board. The attenuation interface includes an inner perimeter having an EMI absorber and an outer perimeter having a metal backing to at least partially surround the EMI absorber.