公开(公告)号：US20180151541A1

公开(公告)日：2018-05-31

申请号：US15575323

申请日：2015-06-26

Applicant: Intel Corporation

Inventor： Kimin JUN ,  Jacob M. JENSEN ,  Patrick MORROW ,  Paul B. FISCHER

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/6835 ,  H01L24/50 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/8612 ,  H01L2224/86214 ,  H01L2224/8689 ,  H01L2224/95001 ,  H01L2225/06579

Abstract: A method including coupling a device substrate to a carrier substrate; aligning a portion of the device substrate to a host substrate; separating the portion of the device substrate from the carrier substrate; and after separating the portion of the device substrate, coupling the portion of the device substrate to the host substrate. A method including coupling a device substrate to a carrier substrate with an adhesive between a device side of the device substrate and the carrier substrate; after coupling the device substrate to the carrier substrate, thinning the device substrate; aligning a portion of the thinned device substrate to a host substrate; separating the portion of the device substrate from the carrier substrate; and coupling the separated portion of the device substrate to the host substrate. An apparatus including a substrate including a submicron thickness and a device layer coupled to a host substrate in a stacked arrangement.