公开(公告)号：US20210057381A1

公开(公告)日：2021-02-25

申请号：US16548255

申请日：2019-08-22

Applicant: Intel Corporation

Inventor： Xavier F. BRUN ,  Kaizad MISTRY ,  Paul R. START ,  Nisha ANANTHAKRISHNAN ,  Yawei LIANG ,  Jigneshkumar P. PATEL ,  Sairam AGRAHARAM ,  Liwei WANG

IPC: H01L25/065 ,  H01L25/18 ,  H01L25/00 ,  H01L21/56 ,  H01L23/367 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00

Abstract: Embodiments include semiconductor packages and methods to form the semiconductor packages. A semiconductor package includes a plurality of first dies on a substrate, an encapsulation layer over the first dies and the substrate, an interface layer over the first dies and the encapsulation layer, and a passive heat spreader on the interface layer, wherein the interface layer thermally couples the first dies to the passive heat spreader. The passive heat spreader includes a silicon (Si) or a silicon carbide (SiC). The interface layer includes a silicon nitride (SiN) material, a silicon monoxide (SiO) material, a silicon carbon nitride (SiCN) material, or a thermal adhesive material. The semiconductor package may include a plurality of second dies and the substrate on a package substrate, a thermal interface material (TIM) over the second dies, the passive heat spreader, and the package substrate, and a heat spreader over the TIM and the package substrate.