公开(公告)号：US20220200177A1

公开(公告)日：2022-06-23

申请号：US17540636

申请日：2021-12-02

Applicant: Intel Corporation

Inventor： Jun LU ,  Wei LIAO ,  Guangying ZHANG ,  Liguang DU ,  Guoliang YING ,  Fangbo ZHU ,  Song Kok HANG ,  Juan A. OROZCO RAMIREZ ,  Wesley B. MORGAN

IPC: H01R12/70 ,  G06F1/18 ,  H01R13/627

Abstract: Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.

公开(公告)号：US20210143566A1

公开(公告)日：2021-05-13

申请号：US16976380

申请日：2018-06-22

Applicant: Intel Corporation

Inventor： Jun LU ,  Wei LIAO ,  Guangying ZHANG ,  Liguang DU ,  Guoliang YING ,  Fangbo ZHU ,  Song Kok HANG ,  Juan A. OROZCO RAMIREZ ,  Wesley B. MORGAN

IPC: H01R12/70 ,  H01R13/627 ,  G06F1/18

Abstract: Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.