公开(公告)号：US20250004205A1

公开(公告)日：2025-01-02

申请号：US18216494

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Dekang CHEN ,  Nicholas PSAILA ,  Zhichao ZHANG ,  Eric J.M. MORET ,  Wesley B. MORGAN ,  Srikant NEKKANTY ,  Sang Yup KIM ,  Mohanraj PRABHUGOUD ,  Chao TIAN

IPC: G02B6/27 ,  G02B6/42

Abstract: Multichannel optical assemblies for optical IO (input output) systems are provided. The optical assemblies comprise an optical isolator. In some examples the optical assemblies also comprise an array of GRIN lenses. In other examples, the optical assemblies also comprise micromirrors.

公开(公告)号：US20220200177A1

公开(公告)日：2022-06-23

申请号：US17540636

申请日：2021-12-02

Applicant: Intel Corporation

Inventor： Jun LU ,  Wei LIAO ,  Guangying ZHANG ,  Liguang DU ,  Guoliang YING ,  Fangbo ZHU ,  Song Kok HANG ,  Juan A. OROZCO RAMIREZ ,  Wesley B. MORGAN

IPC: H01R12/70 ,  G06F1/18 ,  H01R13/627

Abstract: Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.

公开(公告)号：US20210143566A1

公开(公告)日：2021-05-13

申请号：US16976380

申请日：2018-06-22

Applicant: Intel Corporation

Inventor： Jun LU ,  Wei LIAO ,  Guangying ZHANG ,  Liguang DU ,  Guoliang YING ,  Fangbo ZHU ,  Song Kok HANG ,  Juan A. OROZCO RAMIREZ ,  Wesley B. MORGAN

IPC: H01R12/70 ,  H01R13/627 ,  G06F1/18

Abstract: Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.

公开(公告)号：US20200321730A1

公开(公告)日：2020-10-08

申请号：US16906924

申请日：2020-06-19

Applicant: Intel Corporation

Inventor： Wesley B. MORGAN

IPC: H01R13/629 ,  F16C11/04

Abstract: An apparatus is described. The apparatus includes a hinge assembly. The hinge assembly includes: i) a stationary element, a first hole formed in the stationary element to receive a retaining screw; ii) a rotating element that rotates around the retaining screw's axis; and iii) an isolation element between the stationary element and the rotating element located along the retaining screw's axis. The isolation element has a second hole that is aligned with the first hole to receive the retaining screw. The rotating element is to be in contact with and rotate about the isolation element when the retaining screw is torqued down to clamp the isolation element and stationary element together.