公开(公告)号：US20240421025A1

公开(公告)日：2024-12-19

申请号：US18290289

申请日：2021-12-16

Applicant: Intel Corporation

Inventor： Lianchang DU ,  Jeffory L. SMALLEY ,  Srikant NEKKANTY ,  Eric W. BUDDRIUS ,  Yi ZENG ,  Xinjun ZHANG ,  Maoxin YIN ,  Zhichao ZHANG ,  Chen ZHANG ,  Yuehong FAN ,  Mingli ZHOU ,  Guoliang YING ,  Yinglei REN ,  Chong J. ZHAO ,  Jun LU ,  Kai WANG ,  Timothy Glen HANNA ,  Vijaya K. BODDU ,  Mark A. SCHMISSEUR ,  Lijuan FENG

IPC: H01L23/367 ,  H01L23/538 ,  H01L25/065 ,  H01R13/627

Abstract: A semiconductor chip package is described. The semiconductor chip package has a substrate. The substrate has side I/Os on the additional surface area of the substrate. The side I/Os are coupled to I/Os of a semiconductor chip within the semiconductor chip package. A cooling assembly has also been described. The cooling assembly has a passageway to guide a cable to connect to a semiconductor chip's side I/Os that are located between a base of a cooling mass and an electronic circuit board that is between a bolster plate and a back plate and that is coupled to second I/Os of the semiconductor chip through a socket that the semiconductor chip's package is plugged into.

公开(公告)号：US20230420338A1

公开(公告)日：2023-12-28

申请号：US18034133

申请日：2021-03-06

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Tong Wa CHAO ,  Ying-Feng PANG ,  Yi XIA ,  Rahima K. MOHAMMED ,  Victor P. POLYANKO ,  Ridvan A. SAHAN ,  Guangying ZHANG ,  Guoliang YING ,  Chuanlou WANG ,  Jun LU ,  Liguang DU ,  Peng WEI ,  Xiang QUE

IPC: H01L23/473 ,  G06F1/20 ,  H01L23/367

CPC classification number: H01L23/473 ,  G06F1/206 ,  H01L23/3672 ,  G06F2200/201

Abstract: Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.

公开(公告)号：US20220200177A1

公开(公告)日：2022-06-23

申请号：US17540636

申请日：2021-12-02

Applicant: Intel Corporation

Inventor： Jun LU ,  Wei LIAO ,  Guangying ZHANG ,  Liguang DU ,  Guoliang YING ,  Fangbo ZHU ,  Song Kok HANG ,  Juan A. OROZCO RAMIREZ ,  Wesley B. MORGAN

IPC: H01R12/70 ,  G06F1/18 ,  H01R13/627

Abstract: Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.

公开(公告)号：US20210280496A1

公开(公告)日：2021-09-09

申请号：US17255415

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Guoliang YING ,  Jun LU ,  Guanying ZHANG ,  Xinglong XU ,  Wei LIAO ,  Fangbo ZHU

IPC: H01L23/40 ,  H01L23/02 ,  H01L23/367 ,  H01L23/00 ,  H01L21/50

Abstract: Systems, apparatuses, processes, and techniques are provided which are related to a vapor chamber (750) having a first side and a second side opposite the first side, where the first side is to thermally couple to a heat sink (708) and the second side to thermally couple to a heat source. The vapor chamber (750) may include a compressible mechanism disposed within the vapor chamber (750) coupled with the first side and the second side where the second side, when coupled to the heat source, is to deform at least partially to match a shape of the heat source. The compressible mechanism within the vapor chamber (750) may moderate the deformation of the second side.

公开(公告)号：US20210143566A1

公开(公告)日：2021-05-13

申请号：US16976380

申请日：2018-06-22

Applicant: Intel Corporation

Inventor： Jun LU ,  Wei LIAO ,  Guangying ZHANG ,  Liguang DU ,  Guoliang YING ,  Fangbo ZHU ,  Song Kok HANG ,  Juan A. OROZCO RAMIREZ ,  Wesley B. MORGAN

IPC: H01R12/70 ,  H01R13/627 ,  G06F1/18

Abstract: Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.