公开(公告)号：US20220183177A1

公开(公告)日：2022-06-09

申请号：US17677785

申请日：2022-02-22

Applicant: Intel Corporation

Inventor： Zhichao ZHANG ,  Gregorio R. MURTAGIAN ,  Kuang C. LIU ,  Kemal AYGUN

IPC: H05K7/10 ,  H05K1/11 ,  H05K1/02 ,  H01R13/24

Abstract: Embodiments include a transmission line-land grid array (TL-LGA) socket assembly, a TL-LGA socket, and a package substrate. The TL-LGA socket assembly includes a TL-LGA socket having an interconnect in a housing body, the interconnect includes a vertical portion and a horizontal portion. The housing body has a top surface and a bottom surface, where the top surface is a conductive layer. The TL-LGA socket assembly also includes a package substrate having a base layer having a signal pad and a ground strip. The base layer is above the conductive layer of the housing body of the TL-LGA socket. The ground strip is above the horizontal portion of the interconnect and adjacent to the signal pad. The horizontal portion is coupled to the signal pad on the base layer. The package substrate may have a pad with a reduced pad area.