公开(公告)号：US20250006554A1

公开(公告)日：2025-01-02

申请号：US18215692

申请日：2023-06-28

Applicant: Intel Corporation

Inventor： Ramanan Ehamparam ,  Ebubekir Dogan ,  Maria Stancescu

IPC: H01L21/768 ,  H01L21/67

Abstract: Devices, systems, and techniques are described herein related to reducing or eliminating galvanic corrosion of tungsten conductive features within tungsten-boron liners during wet clean thereof. The tungsten-boron liner is treated with a hydrogen/nitrogen plasma to modify a portion of the liner extending from the top surface to include tungsten, boron, nitrogen, and optionally oxygen. The modified portion of the liner reduces or eliminates galvanic corrosion during wet etch clean.