公开(公告)号：US11482433B2

公开(公告)日：2022-10-25

申请号：US16932594

申请日：2020-07-17

Applicant: Intel Corporation

Inventor： Ashutosh Sagar ,  Chao-Kai Liang ,  Miye Hopkins ,  Weimin Han ,  Robert James

IPC: H01L21/67 ,  H05B6/70 ,  H01L21/677

Abstract: Stacked thermal process chamber module for remote radiative heating of semiconductor device workpieces. A stacked thermal process module may include a stack of thermal process chambers and one or more generators of electromagnetic radiation. The electromagnetic radiation may be transported from a generator remote from the process chambers through one or more waveguides, thereby minimizing the volume and/or cleanroom footprint of the stacked thermal process chamber module. A waveguide may terminate in a process chamber so that electromagnetic radiation delivered during a thermal process may be coupled into one or more materials of the workpiece. The radiative heating process may overcome many of the limitations of thermal process chambers that instead employ a local heat source located within a process chamber.

公开(公告)号：US20220020613A1

公开(公告)日：2022-01-20

申请号：US16932594

申请日：2020-07-17

Applicant: Intel Corporation

Inventor： Ashutosh Sagar ,  Chao-Kai Liang ,  Miye Hopkins ,  Weimin Han ,  Robert James

IPC: H01L21/67 ,  H05B6/70

Abstract: Stacked thermal process chamber module for remote radiative heating of semiconductor device workpieces. A stacked thermal process module may include a stack of thermal process chambers and one or more generators of electromagnetic radiation. The electromagnetic radiation may be transported from a generator remote from the process chambers through one or more waveguides, thereby minimizing the volume and/or cleanroom footprint of the stacked thermal process chamber module. A waveguide may terminate in a process chamber so that electromagnetic radiation delivered during a thermal process may be coupled into one or more materials of the workpiece. The radiative heating process may overcome many of the limitations of thermal process chambers that instead employ a local heat source located within a process chamber.