公开(公告)号：US20230314508A1

公开(公告)日：2023-10-05

申请号：US17712100

申请日：2022-04-02

Applicant: Intel Corporation

Inventor： Elik Haran ,  Nir Gerber ,  Tal Davidson ,  Wei Hu ,  Nadav Levison

IPC: G01R31/3183 ,  G01R31/3187 ,  G01R31/3185

CPC classification number: G01R31/318307 ,  G01R31/318597 ,  G01R31/3187

Abstract: Embodiments of apparatuses and methods for in-field testing of an integrated circuit (IC) are disclosed. In an embodiment, an apparatus includes an IC having circuitry to operate in a structural test mode, the structural test mode including a memory built-in self-test (MBIST) mechanism and an automatic test pattern generation (ATPG) mechanism; a microcontroller to enable and control the structural test mode during in-field operation of the IC; and a programmable logic device to support the ATPG mechanism.