公开(公告)号：US20240429221A1

公开(公告)日：2024-12-26

申请号：US18339685

申请日：2023-06-22

Applicant: Intel Corporation

Inventor： Bernd Waidhas ,  Thomas Wagner ,  Georg Seidemann ,  Nicolas Richaud ,  Manisha Dutta ,  Georgios Dogiamis ,  Harshit Dhakad ,  Michael Langenbuch

IPC: H01L25/18 ,  H01L23/31 ,  H01L25/00 ,  H01L27/01 ,  H01Q1/22 ,  H01Q9/04

Abstract: Glass layers and capacitors for use with integrated circuit packages are disclosed. An example integrated circuit (IC) package includes a semiconductor die, a glass layer, and a capacitor electrically coupled to the semiconductor die, at least one side of the capacitor enclosed by the glass layer, the capacitor positioned closer to the glass layer than the semiconductor die is to the glass layer.