公开(公告)号：US20250006719A1

公开(公告)日：2025-01-02

申请号：US18341875

申请日：2023-06-27

Applicant: Intel Corporation

Inventor： Georgios Panagopoulos ,  Richard Geiger ,  Steven Callender ,  Georgios Dogiamis ,  Manisha Dutta ,  Stefano Pellerano

IPC: H01L25/18 ,  H01L23/00 ,  H01Q1/22 ,  H01Q23/00

Abstract: Example antenna module includes antenna units provided over an antenna unit support, and ICs communicatively coupled to various antenna units. The ICs are arranged in two or more subsets of one or more ICs in each subset, where an individual IC belongs to only one subset, different subsets are in different layers with respect to the antenna unit support, and an average pitch of projections of all of the ICs onto a plane parallel to the antenna unit support is substantially equal to, or smaller, than an average pitch of the antenna units. When an average width of the ICs is larger than the average pitch of the antenna units, arranging the ICs in two or more subsets in different layers means that at least one of the ICs of one subset partially overlaps with at least one of the ICs of another subset.

公开(公告)号：US20240429221A1

公开(公告)日：2024-12-26

申请号：US18339685

申请日：2023-06-22

Applicant: Intel Corporation

Inventor： Bernd Waidhas ,  Thomas Wagner ,  Georg Seidemann ,  Nicolas Richaud ,  Manisha Dutta ,  Georgios Dogiamis ,  Harshit Dhakad ,  Michael Langenbuch

IPC: H01L25/18 ,  H01L23/31 ,  H01L25/00 ,  H01L27/01 ,  H01Q1/22 ,  H01Q9/04

Abstract: Glass layers and capacitors for use with integrated circuit packages are disclosed. An example integrated circuit (IC) package includes a semiconductor die, a glass layer, and a capacitor electrically coupled to the semiconductor die, at least one side of the capacitor enclosed by the glass layer, the capacitor positioned closer to the glass layer than the semiconductor die is to the glass layer.