公开(公告)号：US20200051899A1

公开(公告)日：2020-02-13

申请号：US16059535

申请日：2018-08-09

Applicant: Intel Corporation

Inventor： Debendra MALLIK ,  Sanka GANESAN ,  Pilin LIU ,  Shawna LIFF ,  Sri Chaitra CHAVALI ,  Sandeep GAAN ,  Jimin YAO ,  Aastha UPPAL

IPC: H01L23/498 ,  H01L23/28 ,  H01L23/34 ,  H01L23/538 ,  H01L23/532

Abstract: Embodiments include an electronics package and methods of forming such packages. In an embodiment, the electronics package comprises a first package substrate. In an embodiment, the first package substrate comprises, a die embedded in a mold layer, a thermal interface pad over a surface of the die, and a plurality of solder balls over the thermal interface pad. In an embodiment, the thermal interface pad and the solder balls are electrically isolated from circuitry of the electronics package. In an embodiment, the electronics package further comprises a second package substrate over the first package substrate.