公开(公告)号：US20240213074A1

公开(公告)日：2024-06-27

申请号：US18089468

申请日：2022-12-27

Applicant: Intel Corporation

Inventor： Mark SALTAS ,  Edvin CETEGEN ,  Tony DAMBRAUSKAS ,  Albert KAMGA ,  Mine KAYA ,  James MELLODY ,  Rajesh Kumar NEERUKATTI

IPC: H01L21/683 ,  B25J15/06

CPC classification number: H01L21/6838 ,  B25J15/0616 ,  H01L2224/81203

Abstract: This disclosure describes nozzle designs for holding disaggregated die flat in a bonding process. The nozzle designs may have trenches extending radially outward from the center of the nozzle to the corners, such as in a snowflake pattern. The trenches may be positioned to be axially unaligned with any mold dishes of the disaggregated die when lifting the disaggregated die. The trenches may have a depth of at least 200 micrometers to allow for sufficient air flow to prevent warpage of the disaggregated die.