公开(公告)号：US20220240417A1

公开(公告)日：2022-07-28

申请号：US17723099

申请日：2022-04-18

Applicant: Intel Corporation

Inventor： Scott Rider ,  Devdatta Kulkarni

IPC: H05K7/20 ,  H01L23/34 ,  H01L25/065

Abstract: Technologies for dynamic cooling include a computing device having a multi-chip package including multiple dies and a cold plate coupled to the multi-chip package. Micro nozzle valves are coupled to fluid passage zones of the cold plate positioned adjacent to the dies, and are configured to control fluid flow into the fluid passage zones. The computing device reads a predetermined die junction temperature for each die, determines a current die junction temperature for each die, compares the predetermined die junction temperature to the current die junction temperature for each die, and determines a fluid flow rate for each die based on that comparison. The computing device controls the micro nozzle valves adjacent to each die based on the respective fluid flow rate. The dies may include processor cores, field-programmable gate arrays, memory devices, or other computer chips. Other embodiments are described and claimed.

公开(公告)号：US20220015262A1

公开(公告)日：2022-01-13

申请号：US16924789

申请日：2020-07-09

Applicant: Intel Corporation

Inventor： Scott Rider ,  Devdatta Kulkarni

IPC: H05K7/20 ,  H01L25/065 ,  H01L23/34 ,  G06F1/20

Abstract: Technologies for dynamic cooling include a computing device having a multi-chip package including multiple dies and a cold plate coupled to the multi-chip package. Micro nozzle valves are coupled to fluid passage zones of the cold plate positioned adjacent to the dies, and are configured to control fluid flow into the fluid passage zones. The computing device reads a predetermined die junction temperature for each die, determines a current die junction temperature for each die, compares the predetermined die junction temperature to the current die junction temperature for each die, and determines a fluid flow rate for each die based on that comparison. The computing device controls the micro nozzle valves adjacent to each die based on the respective fluid flow rate. The dies may include processor cores, field-programmable gate arrays, memory devices, or other computer chips. Other embodiments are described and claimed.

公开(公告)号：US12035507B2

公开(公告)日：2024-07-09

申请号：US17723099

申请日：2022-04-18

Applicant: Intel Corporation

Inventor： Scott Rider ,  Devdatta Kulkarni

IPC: H05K7/20 ,  H01L23/24 ,  H01L23/34 ,  H01L25/065

CPC classification number: H05K7/20254 ,  H01L23/34 ,  H01L25/065

Abstract: Technologies for dynamic cooling include a computing device having a multi-chip package including multiple dies and a cold plate coupled to the multi-chip package. Micro nozzle valves are coupled to fluid passage zones of the cold plate positioned adjacent to the dies, and are configured to control fluid flow into the fluid passage zones. The computing device reads a predetermined die junction temperature for each die, determines a current die junction temperature for each die, compares the predetermined die junction temperature to the current die junction temperature for each die, and determines a fluid flow rate for each die based on that comparison. The computing device controls the micro nozzle valves adjacent to each die based on the respective fluid flow rate. The dies may include processor cores, field-programmable gate arrays, memory devices, or other computer chips. Other embodiments are described and claimed.