公开(公告)号：US10727368B2

公开(公告)日：2020-07-28

申请号：US16074758

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Myung Jin Yim ,  Seungjae Lee ,  Sandeep Razdan

IPC: H01L27/15 ,  H01L31/12 ,  H01L23/00 ,  H01L25/065 ,  H01L23/48 ,  H01L23/367 ,  H01L23/498 ,  H01L25/16 ,  H01L33/58 ,  H01L33/62

Abstract: Optoelectronic device modules having a silicon photonics transmitter die connected to a silicon interposer are described. In an example, the optoelectronic device module includes a silicon photonics transmitter die connected to a silicon interposer, and the silicon interposer is disposed between the silicon photonics transmitter die and a substrate. The silicon interposer provides an electrical interconnect between the silicon photonics transmitter die and the substrate, and reduces a likelihood that a hybrid silicon laser on the silicon photonics transmitter die will be damaged during module operation.