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    Co-packaging with silicon photonics hybrid planar lightwave circuit
    3.
    发明授权
    Co-packaging with silicon photonics hybrid planar lightwave circuit 有权

    公开(公告)号：US11531174B2

    公开(公告)日：2022-12-20

    申请号：US16642671

    申请日：2017-09-28

    申请人： Intel Corporation

    发明人： Sang Yup Kim ,  Myung Jin Yim ,  Woosung Kim

    IPC分类号： G02B6/43 ,  G02B6/122 ,  G02B6/42 ,  G02B6/12

    摘要： An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

    Co-packaging with silicon photonics hybrid planar lightwave circuit
    6.
    发明授权
    Co-packaging with silicon photonics hybrid planar lightwave circuit 有权

    公开(公告)号：US11982854B2

    公开(公告)日：2024-05-14

    申请号：US17992670

    申请日：2022-11-22

    申请人： Intel Corporation

    发明人： Sang Yup Kim ,  Myung Jin Yim ,  Woosung Kim

    IPC分类号： G02B6/43 ,  G02B6/122 ,  G02B6/42 ,  G02B6/12

    CPC分类号： G02B6/43 ,  G02B6/122 ,  G02B6/4212 ,  G02B6/4274 ,  G02B2006/12061

    摘要： An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

    Method of fabricating an optical module that includes an electronic package
    7.
    发明授权
    Method of fabricating an optical module that includes an electronic package 有权

    公开(公告)号：US10347615B2

    公开(公告)日：2019-07-09

    申请号：US15554144

    申请日：2015-03-24

    申请人： Intel Corporation

    发明人： Myung Jin Yim ,  Jay S. Lee ,  Jong-Min Hong

    IPC分类号： H01L25/16 ,  H01L23/538 ,  H01L23/00

    摘要： Some forms include an electronic package that includes a photo-detecting receiver IC and a receiver IC. The electronic package includes a mold that encloses the photo-detecting receiver IC and the receiver IC. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching one another. Other forms include an optical module that includes a substrate and an electronic package mounted on the substrate. The electronic package includes a photo-detecting receiver IC and a receiver IC that are enclosed within a mold. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching. Other forms include a method that includes forming a mold that includes a photo-detecting receiver IC and a receiver IC that are adjacent to one another without touching. The photo-detecting receiver IC includes optical components that are exposed on a surface of the mold.

    In-package photonics integration and assembly architecture
    8.
    发明授权
    In-package photonics integration and assembly architecture 有权

    公开(公告)号：US10242976B2

    公开(公告)日：2019-03-26

    申请号：US15396467

    申请日：2016-12-31

    申请人： Intel Corporation

    发明人： Myung Jin Yim

    IPC分类号： H01L25/00 ,  H01L25/065 ,  G02B6/42

    摘要： In one embodiment, a microelectronic package structure comprises a substrate comprising at least one waveguide, a first instrument integrated circuit coupled to the substrate, a photonic engine coupled to the substrate and comprising an integrated circuit body, a transmit die. and a receive die. The photonic engine is positioned adjacent the at least one waveguide such that optical signals may be exchanged between the at least one waveguide and the transmit die and the at least one waveguide and the receive die. Other embodiments may be described.