公开(公告)号：US20200083164A1

公开(公告)日：2020-03-12

申请号：US16129711

申请日：2018-09-12

Applicant: Intel Corporation

Inventor： Brandon C. MARIN ,  Frank TRUONG ,  Shivasubramanian BALASUBRAMANIAN ,  Dilan SENEVIRATNE ,  Yonggang LI ,  Sameer PAITAL ,  Darko GRUJICIC ,  Rengarajan SHANMUGAM ,  Melissa WETTE ,  Srinivas PIETAMBARAM

IPC: H01L23/522 ,  H01L49/02 ,  H01L27/01 ,  H01L21/768 ,  H01L23/00

Abstract: Embodiments include package substrates and a method of forming the package substrates. A package substrate includes a dielectric having a cavity that has a footprint, a resistor embedded in the cavity of the dielectric, and a plurality of traces on the resistor, where a plurality of surfaces of the resistor are activated surfaces. The resistor may also have a plurality of sidewalls which may be activated sidewalls and tapered. The dielectric may include metallization particles/ions. The resistor may include resistive materials, such as nickel-phosphorus (NiP), aluminum-nitride (AlN), and/or titanium-nitride (TiN). The package substrate may further include a first resistor embedded adjacently to the resistor. The first resistor may have a first footprint of a first cavity that is different than the footprint of the cavity of the resistor. The resistor may have a resistance value that is thus different than a first resistance value of the first resistor.