公开(公告)号：US20220294115A1

公开(公告)日：2022-09-15

申请号：US17831151

申请日：2022-06-02

Applicant: Intel Corporation

Inventor： Andreas Augustin ,  Sonja Koller ,  Bernd Waidhas ,  Georg Seidemann ,  Andreas Wolter ,  Stephan Stoecki ,  Thomas Wagner ,  Josef Hagn

IPC: H01Q9/04 ,  H01L23/00 ,  H01Q1/22 ,  H01Q21/06

Abstract: A patch antenna array is fabricated with a package-on-package setup that contains a transceiver. The patch antenna array has a footprint that intersects the transceiver footprint. The package-on-package setup includes through-mold vias that couple to a redistribution layer disposed between the patch antennas and the package-on-package setup.