公开(公告)号：US20230016486A1

公开(公告)日：2023-01-19

申请号：US17956486

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Dong-Ho Han ,  Bala Subramanya ,  Greeshmaja Govind ,  Sun Ye E ,  Boon Ping Koh ,  Juha Paavola ,  Kerry Stevens ,  Neil Delaplane ,  Quek Liang Wee

IPC: H01L23/552 ,  H01L25/065 ,  H01L23/367 ,  H01L21/48

Abstract: Electrically conductive compressible gaskets can be employed to ground a heat solution and provide electromagnetic interference (EMI) shielding. A plurality of gaskets may be arranged around the perimeter of an integrated circuit package such as a processor or system on a chip. Each of the gaskets is in contact with a ground plane in the package, and upon contact with a heat sink or cold plate, creates an electrical path that grounds the heat sink or cold plate and thereby minimizes the emission of spurious radio signals. Other embodiments may be described and/or claimed.