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Patent Agency Ranking
公开(公告)号：US20230216453A1
公开(公告)日：2023-07-06
申请号：US18121315
申请日：2023-03-14
Applicant: Intel Corporation
Inventor： Yagnesh V. Waghela , Sumod Cherukkate , Sagar Gupta , Sudhakar Arehole Narayana Manja , Soumya Prakash Mishra , Bala Subramanya , Jayprakash Thakur
CPC classification number: H03F3/189 , H04R9/06 , H03F2200/451 , H03F2200/03
Abstract: The speaker coil in a dynamic speaker in a mobile computing device can be used to generate radio frequency (RF) signals having a frequency of about 100 kHz or greater. A speaker amplifier drives the dynamic speaker to produce sound and RF circuitry drives the speaker amplifier to generate the RF signals having a frequency of about 100 kHz or greater. The speaker coil can comprise a tap at an appropriate point between the ends of the coil to cause the coil to operate at resonance over a desired RF frequency band. A low-pass filter can be positioned at the speaker amplifier output to protect the speaker amplifier from RF energy generated by the RF circuitry and a high-pass filter can be positioned at the output of the RF circuitry to protect the RF circuitry from audio energy generated by the speaker amplifier.
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公开(公告)号：US20250113430A1
公开(公告)日：2025-04-03
申请号：US18513045
申请日：2023-11-17
Applicant: Intel Corporation
Inventor： Venkata Mahesh Gunnam , Rakesh Yedri , Phani Alaparthi , David Elayaraj Samaraj , Jackson C.P. Kong , Bala Subramanya , Navneet Kumar Singh , Yagnesh V. Waghela
Abstract: Technologies for reducing the impact of inductors on electrical traces are disclosed. In an illustrative embodiment, conductive ink is applied in a silk screen layer on top of a solder mask of a circuit board. The conductive ink forms shield regions under and near where inductors are placed and/or where a power plane is routed. The conductive shield regions may be coupled to a ground plane in the circuit board. The conductive shield regions can partially shield traces under and near the inductor, reducing the noise induced on nearby traces. The conductive shield regions can allow traces for high-speed input/output signals to be routed closer to the inductor, reducing the size, number of layers, and/or cost of the circuit board. In some embodiments, the conductive shield regions can shield emissions from the power plane, reducing interference on antennas of a device.
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公开(公告)号：US20240019914A1
公开(公告)日：2024-01-18
申请号：US18477881
申请日：2023-09-29
Applicant: Intel Corporation
Inventor： Krishnendu Saha , Pawan Shiv Vadakattu , Samarth Alva , Bala Subramanya
IPC: G06F1/20 , H05K7/20 , H02M7/5387
CPC classification number: G06F1/20 , H05K7/20172 , H02M7/5387
Abstract: In one embodiment, an AC ionic blower apparatus includes a housing defining a hole through the housing, a first electrode formed around the hole, a second electrode formed around the hole, and a dielectric material between the first electrode and the second electrode. The center of the second electrode is offset from the center of the first electrode.
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公开(公告)号：US20230016486A1
公开(公告)日：2023-01-19
申请号：US17956486
申请日：2022-09-29
Applicant: Intel Corporation
Inventor： Dong-Ho Han , Bala Subramanya , Greeshmaja Govind , Sun Ye E , Boon Ping Koh , Juha Paavola , Kerry Stevens , Neil Delaplane , Quek Liang Wee
IPC: H01L23/552 , H01L25/065 , H01L23/367 , H01L21/48
Abstract: Electrically conductive compressible gaskets can be employed to ground a heat solution and provide electromagnetic interference (EMI) shielding. A plurality of gaskets may be arranged around the perimeter of an integrated circuit package such as a processor or system on a chip. Each of the gaskets is in contact with a ground plane in the package, and upon contact with a heat sink or cold plate, creates an electrical path that grounds the heat sink or cold plate and thereby minimizes the emission of spurious radio signals. Other embodiments may be described and/or claimed.
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