公开(公告)号：US20230209775A1

公开(公告)日：2023-06-29

申请号：US17561916

申请日：2021-12-24

Applicant: Intel Corporation

Inventor： Javed Shaikh ,  Kathiravan Dhandapani ,  Greeshmaja Govind ,  Asif S. Khan ,  Bijendra Singh ,  Yagnesh V. Waghela

IPC: H05K7/20 ,  F28D15/04 ,  F28D15/06 ,  F28D15/02 ,  G06F1/20

CPC classification number: H05K7/20336 ,  F28D15/06 ,  F28D15/046 ,  F28D15/0208 ,  F28D15/0233 ,  G06F1/20 ,  H05K7/20381 ,  G06F2200/201

Abstract: Wire coils are distributed over the bottom surface of an inner chamber of a vapor chamber. The working fluid of the vapor chamber comprises ferromagnetic particles that are attracted to a wire coil as current passes through the wire coil. The resulting increase in the volumetric concentration of ferromagnetic particles in the vicinity of the activated wire coil increases the capacity of the working fluid to remove heat from an integrated circuit component attached to the vapor chamber in the region of the activated wire coil. The vapor chamber wire coils can be activated based on performance metrics associated with the processor units of an integrated circuit component, thereby allowing for the thermal resistance of the working fluid to be dynamically adjusted based on the workload executing on the integrated circuit component and power consumption transients.

公开(公告)号：US20230016486A1

公开(公告)日：2023-01-19

申请号：US17956486

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Dong-Ho Han ,  Bala Subramanya ,  Greeshmaja Govind ,  Sun Ye E ,  Boon Ping Koh ,  Juha Paavola ,  Kerry Stevens ,  Neil Delaplane ,  Quek Liang Wee

IPC: H01L23/552 ,  H01L25/065 ,  H01L23/367 ,  H01L21/48

Abstract: Electrically conductive compressible gaskets can be employed to ground a heat solution and provide electromagnetic interference (EMI) shielding. A plurality of gaskets may be arranged around the perimeter of an integrated circuit package such as a processor or system on a chip. Each of the gaskets is in contact with a ground plane in the package, and upon contact with a heat sink or cold plate, creates an electrical path that grounds the heat sink or cold plate and thereby minimizes the emission of spurious radio signals. Other embodiments may be described and/or claimed.