公开(公告)号：US20250105119A1

公开(公告)日：2025-03-27

申请号：US18373848

申请日：2023-09-27

Applicant: Intel Corporation

Inventor： Yuqin LI ,  Jesse JONES ,  Sandrine LTEIF ,  Srinivas V. PIETAMBARAM ,  Suresh Tanaji NARUTE ,  Pramod MALATKAR ,  Gang DUAN ,  Khaled AHMED

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/15

Abstract: Embodiments disclosed herein include glass cores with vias that are lined by a self-healing liner. In an embodiment, an apparatus comprises a substrate that comprises a solid glass layer with an opening through a thickness of the substrate. In an embodiment, a liner is in contact with a sidewall of the opening, where the liner comprises a polymer matrix with capsules distributed through the polymer matrix. In an embodiment, each capsule comprises a shell, and a core within the shell. In an embodiment, the core comprises an organic material. In an embodiment, a via is in the opening and in contact with the liner, and the via is electrically conductive.