公开(公告)号：US20240063136A1

公开(公告)日：2024-02-22

申请号：US17891560

申请日：2022-08-19

Applicant: Intel Corporation

Inventor： Haris Khan Niazi ,  Yi Shi ,  Adel Elsherbini ,  Xavier Brun ,  Georgios Dogiamis ,  Thomas Brown ,  Omkar Karhade

IPC: H01L23/544

CPC classification number: H01L23/544 ,  H01L2223/54426 ,  H01L2223/54473

Abstract: An integrated circuit (IC) device comprises an array comprising rows and columns of conductive interconnect pads. At least one optical alignment fiducial region is distinct from the array and comprises a fiducial pattern, wherein the fiducial pattern comprises a first group of pads contiguous to a second group of pads, and wherein a width of a space between nearest pads of the first and second groups is wider than the spaces between pads within each group.