公开(公告)号：US20220199551A1

公开(公告)日：2022-06-23

申请号：US17129838

申请日：2020-12-21

Applicant: Intel Corporation

Inventor： Amit Kumar JAIN ,  Sameer SHEKHAR ,  Telesphor KAMGAING ,  Chin Lee KUAN ,  Vivek SAXENA

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/64 ,  H01L49/02 ,  H01L23/498

Abstract: Embodiments disclosed herein include electronic packages with stiffeners. In an embodiment, a stiffener for an electronic package comprises a first layer, that is conductive, and a second layer over the first layer, where the second layer is insulative. In an embodiment, the stiffener further comprises a third layer over the second layer, where the third layer is conductive. In an embodiment, the stiffener further comprises a leg attached to the third layer, where the leg extends towards the first layer and is substantially coplanar with a surface of the first layer opposite from the second layer.