公开(公告)号：US20210280496A1

公开(公告)日：2021-09-09

申请号：US17255415

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Guoliang YING ,  Jun LU ,  Guanying ZHANG ,  Xinglong XU ,  Wei LIAO ,  Fangbo ZHU

IPC: H01L23/40 ,  H01L23/02 ,  H01L23/367 ,  H01L23/00 ,  H01L21/50

Abstract: Systems, apparatuses, processes, and techniques are provided which are related to a vapor chamber (750) having a first side and a second side opposite the first side, where the first side is to thermally couple to a heat sink (708) and the second side to thermally couple to a heat source. The vapor chamber (750) may include a compressible mechanism disposed within the vapor chamber (750) coupled with the first side and the second side where the second side, when coupled to the heat source, is to deform at least partially to match a shape of the heat source. The compressible mechanism within the vapor chamber (750) may moderate the deformation of the second side.