公开(公告)号：US20240327679A1

公开(公告)日：2024-10-03

申请号：US18194395

申请日：2023-03-31

Applicant: Intel Corporation

Inventor： Yuan MENG ,  Elizabeth NOFEN ,  Zhixin XIE ,  Dingying XU ,  Seyed Hadi ZANDAVI

IPC: C09J7/38 ,  C09J11/04 ,  H05K13/00

CPC classification number: C09J7/38 ,  C09J11/04 ,  H05K13/0069 ,  C09J2301/408

Abstract: This disclosure describes systems, methods, and devices related to switchable adhesion. A switchable adhesion system may comprise a shape memory polymer having a shaped surface to enhance adhesion using a trigger and a force applied to the shape memory polymer, wherein the trigger is applied to alter characteristics of the shape memory polymer, and wherein the force is applied to deform the shape memory polymer while the trigger is applied. The system may further comprise a media tray connected to the shape memory polymer.