公开(公告)号：US20240210634A1

公开(公告)日：2024-06-27

申请号：US18089501

申请日：2022-12-27

Applicant: Intel Corporation

Inventor： Zhixin XIE ,  Jung Kyu HAN ,  Gang DUAN

IPC: G02B6/42 ,  G02B1/04 ,  G02B3/00

CPC classification number: G02B6/4206 ,  G02B1/041 ,  G02B3/0087 ,  G02B6/4214 ,  G02B6/428

Abstract: Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a substrate and an optical fiber in the substrate. In an embodiment, a lens is optically coupled to the optical fiber. In an embodiment, the lens is a gradient index (GRIN) lens.

公开(公告)号：US20240327679A1

公开(公告)日：2024-10-03

申请号：US18194395

申请日：2023-03-31

Applicant: Intel Corporation

Inventor： Yuan MENG ,  Elizabeth NOFEN ,  Zhixin XIE ,  Dingying XU ,  Seyed Hadi ZANDAVI

IPC: C09J7/38 ,  C09J11/04 ,  H05K13/00

CPC classification number: C09J7/38 ,  C09J11/04 ,  H05K13/0069 ,  C09J2301/408

Abstract: This disclosure describes systems, methods, and devices related to switchable adhesion. A switchable adhesion system may comprise a shape memory polymer having a shaped surface to enhance adhesion using a trigger and a force applied to the shape memory polymer, wherein the trigger is applied to alter characteristics of the shape memory polymer, and wherein the force is applied to deform the shape memory polymer while the trigger is applied. The system may further comprise a media tray connected to the shape memory polymer.

公开(公告)号：US20240222216A1

公开(公告)日：2024-07-04

申请号：US18091034

申请日：2022-12-29

Applicant: Intel Corporation

Inventor： Zhixin XIE ,  Jung Kyu HAN ,  Gang DUAN

IPC: H01L23/31 ,  G02B6/42 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L23/3135 ,  G02B6/4239 ,  H01L21/563 ,  H01L21/565 ,  H01L23/295 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/3201 ,  H01L2224/32054 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1811 ,  H01L2924/1815 ,  H01L2924/182 ,  H01L2924/186 ,  H01L2924/3511

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a package substrate with a die coupled to the package substrate by a plurality of interconnects. In an embodiment, a first layer is on the package substrate surrounding the die, and a second layer is over and around the die. In an embodiment, the second layer underfills the plurality of interconnects, and the second layer has a different material composition than the first layer.

公开(公告)号：US20240188223A1

公开(公告)日：2024-06-06

申请号：US18060581

申请日：2022-12-01

Applicant: Intel Corporation

Inventor： Zhixin XIE ,  Jung Kyu HAN ,  Gang DUAN

IPC: H05K3/28 ,  B29C70/70

CPC classification number: H05K3/284 ,  B29C70/70 ,  B29L2031/3406

Abstract: There may be provided an apparatus. The apparatus may include a first dispensing unit and a second dispensing unit. The apparatus may further include a connection assembly coupled to the first dispensing unit and the second dispensing unit in a manner such that a position of the first dispensing unit or the second dispensing unit relative to the other of said first dispensing unit or second dispensing unit may be adjustable via the connection assembly.