公开(公告)号：US20200131031A1

公开(公告)日：2020-04-30

申请号：US16440860

申请日：2019-06-13

Applicant: InvenSense, Inc.

Inventor： Daesung LEE ,  Dongyang KANG ,  Chienlu CHANG ,  Bongsang KIM ,  Alan CUTHBERTSON

IPC: B81B7/02 ,  B81C1/00 ,  B81C3/00

Abstract: Provided herein is a method including fusion bonding a handle wafer to a first side of a device wafer. A hardmask is deposited on a second side of the device wafer, wherein the second side is planar. The hardmask is etched to form a MEMS device pattern and a standoff pattern. Standoffs are formed on the device wafer, wherein the standoffs are defined by the standoff pattern. A eutectic bond metal is deposited on the standoffs, the device wafer, and the hardmask. A first photoresist is deposited and removed, such that the first photoresist covers the standoffs. The eutectic bond metal is etched using the first photoresist. The MEMS device pattern is etched into the device wafer. The first photoresist and the hardmask are removed.