公开(公告)号：US20160060100A1

公开(公告)日：2016-03-03

申请号：US14559715

申请日：2014-12-03

Applicant: InvenSense, Inc.

Inventor： Peter SMEYS ,  Mozafar MAGHSOUDNIA

IPC: B81B7/00

CPC classification number: B81B7/007 ,  B81B7/008 ,  B81C1/00238 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/00014

Abstract: A method and system for providing a MEMS sensor integrated with a flip chip are disclosed. In a first aspect, the system comprises a MEMS sensor, at least one flip chip coupled to the MEMS sensor, and at least one through-silicon via (TSV) that electrically connects the at least one flip chip to the MEMS sensor. In a second aspect, the system comprises a MEMS sensor that includes a CMOS coupled to a MEMS structure, wherein the CMOS comprises a substrate coupled to an interconnect in contact with the MEMS structure. The system further comprises a plurality of flip chips coupled to the substrate, a plurality of TSV that electrically connect the plurality of flip chips to the interconnect, and a plurality of layers on the substrate to provide electrical connections between the plurality of flip chips and from the plurality of flip chips to at least one external component.

Abstract translation: 公开了一种用于提供与倒装芯片集成的MEMS传感器的方法和系统。 在第一方面，该系统包括MEMS传感器，耦合到MEMS传感器的至少一个倒装芯片以及将至少一个倒装芯片电连接到MEMS传感器的至少一个穿硅通孔（TSV）。 在第二方面，该系统包括MEMS传感器，其包括耦合到MEMS结构的CMOS，其中CMOS包括耦合到与MEMS结构接触的互连的衬底。 该系统还包括耦合到衬底的多个倒装芯片，将多个倒装芯片电连接到互连件的多个TSV以及衬底上的多个层，以提供多个倒装芯片之间的电连接 所述多个倒装芯片至少一个外部部件。