公开(公告)号：US20040161186A1

公开(公告)日：2004-08-19

申请号：US10368195

申请日：2003-02-18

Applicant: JDS Uniphase Corporation, State of Incorporation: Delaware

Inventor： Douglas E. Crafts ,  James F. Farrell ,  Mark B. Farrelly ,  Duane Cook ,  Satyanarayana Rao Peddada

IPC: G02B006/12

CPC classification number: G02B6/12019 ,  G02B6/12004 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4249

Abstract: An optical packaging arrangement combines a planar lightwave circuit (PLC) having an array of waveguides thereon, an array of photodetectors on a substrate to receive light beams coupled out of the PLC by the output ports, and a collimating faceplate, having a plurality of glass cores, extending between the PLC and the photodetector array for coupling the output light beams to respective photodetectors. The faceplate forms a cover for a hermetic cavity encompassing the photodetectors. The PLC is disposed either co-planarly with the faceplate or transversely to it. Light from the PLC is tapped via a plurality of taps formed on the PLC for coupling to the photodetectors.

Abstract translation: 光学封装装置将具有波导阵列的平面光波电路（PLC），基板上的阵列的光电检测器组合，以接收由输出端口耦合到PLC外的光束;以及准直面板，具有多个玻璃 芯，在PLC和光电检测器阵列之间延伸，用于将输出光束耦合到相应的光电检测器。 面板形成用于包围光电检测器的密封腔的盖。 PLC与面板共面或横向地布置。 来自PLC的光通过形成在PLC上的多个抽头被分接，以耦合到光电检测器。