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    Embedded optical coupling in circuit boards
    2.
    发明申请
    Embedded optical coupling in circuit boards 有权
    电路板中的嵌入式光耦合器

    公开(公告)号：US20040264838A1

    公开(公告)日：2004-12-30

    申请号：US10814011

    申请日：2004-03-31

    发明人： Toshi K. Uchida ,  Masataka Ito

    IPC分类号： G02B006/12

    CPC分类号： G02B6/43 ,  G02B6/4214 ,  H05K1/0274

    摘要： A circuit board has embedded optical fibers terminating in fiber ends which face into holes defined in the circuit board and optoelectronic emitter or detector modules mounted in the holes in optical coupling with the fiber ends. Each module is electrically connected to circuit traces on the circuit board and is optically coupled to one or more optical fibers terminating on a side surface of the hole. The modules have an optical axis oriented into the hole and a reflector supported in the hole for optically coupling the photo emitter/detector module with the fiber ends on the side surface of the hole.

    摘要翻译： 电路板具有端接在光纤端部的嵌入式光纤，其面向电路板中限定的孔和安装在孔中的光电子发射器或检测器模块，与光纤端部进行光耦合。 每个模块电连接到电路板上的电路迹线，并且光耦合到终止于孔的侧表面上的一个或多个光纤。 模块具有定向到孔中的光轴和支撑在孔中的反射器，用于将光发射器/检测器模块与孔的侧表面上的光纤端部光学耦合。

    Thermally isolating optical devices
    3.
    发明申请
    Thermally isolating optical devices 失效
    热隔离光学器件

    公开(公告)号：US20040258344A1

    公开(公告)日：2004-12-23

    申请号：US10465210

    申请日：2003-06-19

    发明人： Behzad Fardi ,  Farshid Adibi ,  Chaoyang Li ,  Anirban Bandyopadhyay ,  Mahesh Junnarkar

    IPC分类号： G02B006/12

    CPC分类号： G02F1/025 ,  G02F1/0147

    摘要： A thermo-optic device may be formed with trenches that undercut the substrate beneath the thermo-optic device. Through the removal of the underlying substrate, the heat dissipation of the thermo-optic device may be reduced. This may reduce the thermal budget of the device, reducing the power requirements for operating the device in some embodiments.

    摘要翻译： 热光器件可以形成有在热光器件下面切割衬底的沟槽。 通过去除下面的衬底，可以减少热光器件的散热。 这可能降低装置的热量预算，在一些实施例中减少了操作装置的功率要求。

    Method of providing a low cost semiconductor transmitter photonic integrated circuit (TxPIC) chip
    4.
    发明申请
    Method of providing a low cost semiconductor transmitter photonic integrated circuit (TxPIC) chip 有权
    提供低成本半导体发射器光子集成电路（TxPIC）芯片的方法

    公开(公告)号：US20040247233A1

    公开(公告)日：2004-12-09

    申请号：US10887632

    申请日：2004-07-09

    发明人： Stephen G. Grubb ,  Matthew L. Mitchell ,  Robert B. Taylor ,  Ting-Kuang Chiang ,  Vincent G. Dominic

    IPC分类号： G02B006/12

    CPC分类号： G02B6/12019 ,  G02B6/12004 ,  H01S3/06754 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/12 ,  H01S5/4012 ,  H01S5/4031 ,  H04B10/25

    摘要： A method of deploying a passive optical combiner that is a broad bandwidth spectral wavelength combiner for combining the outputs from multiples transmitter photonic integrated circuit (TxPIC) chips and, thereafter, the amplification of the combined channel signals with a booster optical amplifier couple between the passive optical combiner and the fiber transmission link. The booster optical amplifier may be a rear earth fiber amplifier, such as an erbium doped fiber amplifier (EDFA), or one or more semiconductor optical amplifiers (SOAs) on one or more semiconductor chips. Such a combination of optical components simplifies the design of individual TxPICs and other such optical communication PICs, which has to take into consideration the nonlinear effects of difficult, high loss single mode fiber (SMF) links or other fiber-type links by allowing a higher power per channel to be achieved compared to the case where channel amplification is attempted directly on the TxPIC chip through the deployment of on-chip optical amplifiers, such as semiconductor optical amplifiers (SOAs), integrated in locations following the electro-optic (EO) modulators, if not integrated also at other locations on the same chip

    摘要翻译： 一种部署无源光合并器的方法，该无源光合并器是宽带光谱波长组合器，用于组合来自多个发射器光子集成电路（TxPIC）芯片的输出，此后，通过增强型光放大器耦合在被动 光合并器和光纤传输链路。 增强型光放大器可以是诸如掺铒光纤放大器（EDFA）的后置接地光纤放大器或一个或多个半导体芯片上的一个或多个半导体光放大器（SOA）。 这样的光学部件的组合简化了单独的TxPIC和其它这样的光通信PIC的设计，其必须通过允许较高的光纤通道PIC来考虑困难的高损耗单模光纤（SMF）链路或其他光纤类型链路的非线性效应 与通过部署诸如半导体光放大器（SOAs）的片上光放大器（Tx）集成在电光（EO））之后的位置，直接在TxPIC芯片上尝试通道放大的情况相比， 调制器，如果没有集成在同一芯片的其他位置

    Monitoring power in optical networks
    5.
    发明申请
    Monitoring power in optical networks 失效
    监控光网络中的功率

    公开(公告)号：US20040240783A1

    公开(公告)日：2004-12-02

    申请号：US10448759

    申请日：2003-05-30

    发明人： Mahesh R. Junnarkar ,  Anirban Bandyopadhyay

    IPC分类号： G02B006/12

    CPC分类号： G02B6/42 ,  G02B6/4206 ,  G02B6/4214

    摘要： An optical network may include a detector for detecting the power of each of a plurality of channels of a wavelength division multiplexed optical signal in one embodiment of the present invention. Each channel may be conveyed to an interface underneath a detector by way of a core formed in the substrate. The interface may include a trench with one side surface angled to form a reflector to reflect light upwardly to be detected by the detector. The trench may be filled with a convex microlens.

    摘要翻译： 在本发明的一个实施例中，光网络可以包括用于检测波分复用光信号的多个信道中的每一个的功率的检测器。 每个通道可以通过形成在基板中的芯体传送到检测器下面的界面。 界面可以包括具有一个侧表面成角度以形成反射器的沟槽，以将光向上反射以由检测器检测。 沟槽可以填充凸起的微透镜。

    Manufacturable optical connection assemblies
    6.
    发明申请
    Manufacturable optical connection assemblies 有权

    公开(公告)号：US20040240774A1

    公开(公告)日：2004-12-02

    申请号：US10880289

    申请日：2004-06-29

    发明人： Lawrence Jacobowitz ,  John U. Knickerbocker ,  Ronald P. Luijten ,  Subhash L. Shinde

    IPC分类号： G02B006/12

    CPC分类号： G02B6/43 ,  G02B6/4228 ,  G02B6/4249

    摘要： A set of interlocking modules supports and connects a die containing lasers, a set of precision molded lenses and a set of beam switching elements. Another embodiment of the invention is a structure for mounting a logic chip and an optical chip on a chip carrier, with the optical chip being mounted on the side of the carrier facing the system board on which the carrier is mounted, so that radiation travels in a straight path from optical sources on the optical chip into optical transmission guides on the board.

    Efficient light coupler from off-chip to on-chip waveguides
    8.
    发明申请
    Efficient light coupler from off-chip to on-chip waveguides 有权
    从芯片到片上波导的高效光耦合器

    公开(公告)号：US20040223680A1

    公开(公告)日：2004-11-11

    申请号：US10421640

    申请日：2003-04-22

    发明人： Bruce A. Block ,  Paul Davids

    IPC分类号： G02B006/12 ,  G02B006/26 ,  G02B006/42

    CPC分类号： G02B6/125 ,  G02B6/12004 ,  G02B6/42 ,  G02B6/4214

    摘要： In an embodiment, light from a single mode light source may be deflected into a low index contrast (LIC) waveguide in an opto-electronic integrated circuit (OEIC) (or nullopto-electronic chipnull) by a 45 degree mirror. The mirror may be formed by polishing an edge of the die at a 45 degree angle and coating the polished edge with a metal layer. Light coupled into the LIC waveguide may then be transferred from the LIC waveguide to a high index contrast (HIC) waveguide by evanescent coupling.

    摘要翻译： 在一个实施例中，来自单模光源的光可以通过45度反射镜偏转到光电集成电路（OEIC）（或“光电芯片”）中的低折射率对比度（LIC）波导中。 可以通过以45度的角度抛光模具的边缘并且用金属层涂覆抛光的边缘来形成反射镜。 耦合到LIC波导中的光然后可以通过ev逝耦合从LIC波导传输到高折射率对比度（HIC）波导。

    Highly parallel optical communication system with intracard and intercard communications
    9.
    发明申请
    Highly parallel optical communication system with intracard and intercard communications 有权
    高度并行的光通信系统，具有智能卡和通讯卡

    公开(公告)号：US20040213503A1

    公开(公告)日：2004-10-28

    申请号：US10252145

    申请日：2002-09-19

    发明人： Kit M. Cham ,  Lisa A. Buckman

    IPC分类号： G02B006/12

    CPC分类号： G02B6/3512 ,  G02B6/3546 ,  G02B6/3596 ,  G02B6/43

    摘要： An optical communications system including a method and apparatus with an electro-optical chip which includes optical interface elements in optical interface array configuration on a first side of the electro-optical chip, attached to or integrated with an optical circuit board which includes a plurality of layered optical wave guides, a plurality of coupling elements disposed relative to the electro-optical chip such that the plurality of coupling elements optically communicate with the first plurality of optical interface elements on the electro-optical chip, and wherein the coupling elements are further disposed to optically communicate with the plurality of optical wave guides.

    摘要翻译： 一种光通信系统，包括具有电光芯片的方法和装置，所述方法和装置包括在所述电光芯片的第一侧上的光接口阵​​列配置中的光接口元件，所述光接口元件附接到或与光电路板集成，所述光电路板包括多个 分层光波导，相对于电光芯片设置的多个耦合元件，使得多个耦合元件与电光芯片上的第一多个光接口元件光学连通，并且其中耦合元件进一步设置 与多个光波导光学通信。