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公开(公告)号：US20250011561A1
公开(公告)日：2025-01-09
申请号：US18886548
申请日：2024-09-16
Applicant: JSP Corporation
Inventor： Tatsuya HAYASHI , Akinobu HIRA
IPC: C08J9/18
Abstract: A polyamide-based resin expanded bead comprising a foam layer formed by expanding a polyamide-based resin, wherein on a first DSC curve and a second DSC curve, the first DSC curve has a melting peak (intrinsic peak) having a peak top temperature on a low temperature side equal to or lower than a peak top temperature of a melting peak of the second DSC curve and a melting peak (high temperature peak) having a peak top temperature on a high temperature side exceeding the peak top temperature of the second DSC curve, and, the peak top temperature of the melting peak of the second DSC curve is 180° C. or higher and 280° C. or lower, and the polyamide-based resin expanded bead has an apparent density of 10 to 300 kg/m3 and a closed cell ratio of 85% or more.
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公开(公告)号：US20240166836A1
公开(公告)日：2024-05-23
申请号：US18553026
申请日：2022-03-01
Applicant: JSP Corporation
Inventor： Tatsuya HAYASHI
CPC classification number: C08J9/16 , C08J9/0052 , C08J9/0066 , C08J2205/052 , C08J2377/06
Abstract: A method for producing a polyamide-based resin expanded bead, the method comprising expanding a polyamide-based resin bead using a physical blowing agent, wherein the polyamide-based resin bead comprises a coloring pigment and a higher fatty acid metal salt having 12 to 24 carbon atoms; a metal in the higher fatty acid metal salt is one or more metals selected from the group consisting of magnesium, aluminum, and zinc; and a content of the higher fatty acid metal salt in the polyamide-based resin bead is 500 to 5000 mass ppm.
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公开(公告)号：US20210253819A1
公开(公告)日：2021-08-19
申请号：US17171732
申请日：2021-02-09
Applicant: JSP Corporation
Inventor： Tatsuya HAYASHI
IPC: C08J9/18
Abstract: Polyamide-based resin expanded beads having a crystallite size of more than 8 nm as measured by X-ray diffraction method are provided.
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4.发明申请公开(公告)号：US20190382550A1
公开(公告)日：2019-12-19
申请号：US16463755
申请日：2017-11-15
Applicant: JSP Corporation
Inventor： Tatsuya HAYASHI , Nobumasa KOSHITA , Masaharu OIKAWA
Abstract: The present invention provides expanded beads of thermoplastic polyurethane, wherein the thermoplastic polyurethane constituting the expanded beads is an ether-based thermoplastic polyurethane, and a difference (T1−T2) between a melting peak temperature (T1) and a melting peak temperature (T2) is from 0 to 8° C., wherein the melting peak temperature (T1) is a melting peak temperature at the time of first heating in a DSC curve obtained by heating the expanded beads from 20° C. to 260° C. at a heating rate of 10° C./min, the melting peak temperature (T2) is a melting peak temperature at the time of second heating in a DSC curve obtained by cooling from 260° C. to 20° C. at a cooling rate of 10° C./min after the first heating and further heating again from 20° C. to 260° C. at a heating rate of 10° C./min, and the DSC curves are obtained by the heat flux differential scanning calorimetry in conformity with JIS K7121-1987. The expanded beads of thermoplastic polyurethane not only have excellent surface appearance and fusion bonding properties but also have a low shrinkage factor.
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公开(公告)号：US20250043092A1
公开(公告)日：2025-02-06
申请号：US18886123
申请日：2024-09-16
Applicant: JSP Corporation
Inventor： Tatsuya HAYASHI , Akinobu HIRA
IPC: C08J9/18
Abstract: A polyamide-based resin expanded bead comprising a foam layer formed by expanding a polyamide-based resin, wherein on a first DSC curve and a second DSC curve, the first DSC curve has a melting peak (intrinsic peak) having a peak top temperature on a low temperature side equal to or lower than a peak top temperature of a melting peak of the second DSC curve and a melting peak (high temperature peak) having a peak top temperature on a high temperature side exceeding the peak top temperature of the second DSC curve, and, the peak top temperature of the melting peak of the second DSC curve is 180° C. or higher and 280° C. or lower, and the polyamide-based resin expanded bead has an apparent density of 10 to 300 kg/m3 and a closed cell ratio of 85% or more.
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Patent Agency Ranking
公开(公告)号：US20250002666A1
公开(公告)日：2025-01-02
申请号：US18883366
申请日：2024-09-12
Applicant: JSP Corporation
Inventor： Tatsuya HAYASHI , Akinobu HIRA
IPC: C08J9/18
Abstract: A polyamide-based resin expanded bead comprising a foam layer formed by expanding a polyamide-based resin, wherein on a first DSC curve and a second DSC curve, the first DSC curve has a melting peak (intrinsic peak) having a peak top temperature on a low temperature side equal to or lower than a peak top temperature of a melting peak of the second DSC curve and a melting peak (high temperature peak) having a peak top temperature on a high temperature side exceeding the peak top temperature of the second DSC curve, and, the peak top temperature of the melting peak of the second DSC curve is 180° C. or higher and 280° C. or lower, and the polyamide-based resin expanded bead has an apparent density of 10 to 300 kg/m3 and a closed cell ratio of 85% or more.
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公开(公告)号：US20250002665A1
公开(公告)日：2025-01-02
申请号：US18700947
申请日：2022-09-13
Applicant: JSP CORPORATION
Inventor： Akinobu HIRA , Tokunobu NOHARA , Tatsuya HAYASHI
Abstract: A polyethylene-based resin expanded bead including a non-crosslinked linear low-density polyethylene as a base resin. The density, heat of fusion, melting point, and melt flow rate measured under conditions of a temperature of 190° C. and a load of 2.16 kg of the linear low-density polyethylene fall within their respective predetermined ranges. The average cell diameter of the expanded beads is 50 μm or more and 180 μm or less.
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公开(公告)号：US20230053755A1
公开(公告)日：2023-02-23
申请号：US17794760
申请日：2021-02-01
Applicant: JSP CORPORATION
Inventor： Tatsuya HAYASHI
IPC: C08J9/16
Abstract: Polyamide-based resin expanded beads contain a polyamide-based resin as a base material resin. The beads have a crystal structure, an intrinsic peak of the polyamide-based resin and a high-temperature peak having a peak top temperature on a higher temperature side than a peak top temperature of the intrinsic peak appear in a DSC curve obtained under a predetermined condition; an amount of heat of fusion of the high-temperature peak is within 5 J/g or more and 50 J/g or less; and a coefficient of variation of the amount of heat of fusion of the high-temperature peak is 20% or less. The beads are produced by in-mold molding. A method for producing the beads includes: impregnating a polyamide-based resin; and releasing expandable polyamide-based resin beads from a sealed container, a temperature in the sealed container is raised at a rate of 0.3° C. or higher and 1.5° C. or lower per 10 minutes.
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公开(公告)号：US20250043091A1
公开(公告)日：2025-02-06
申请号：US18782655
申请日：2024-07-24
Applicant: JSP CORPORATION
Inventor： Tatsuya HAYASHI
Abstract: A polyamide-based resin melt obtained by melt-kneading a base resin, an organic compound-based additive (A), and an iodide-based additive (X) is granulated to prepare polyamide-based resin particles. The polyamide-based resin particles are expanded by using a physical blowing agent to produce polyamide-based resin expanded beads. The polyamide-based resin expanded beads are in-mold molded to produce a polyamide-based resin expanded molded article. The organic compound-based additive (A) is made of a hindered phenol-based compound and/or an organophosphorus-based compound. The iodide-based additive (X) is made of copper iodide, or copper iodide and potassium iodide.
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10.发明申请公开(公告)号：US20210253818A1
公开(公告)日：2021-08-19
申请号：US17168762
申请日：2021-02-05
Applicant: JSP CORPORATION
Inventor： Tatsuya HAYASHI
Abstract: The polyamide-based resin expanded beads are expanded beads including a polyamide-based resin as a base resin, in which the average value of bead weight of the expanded beads is 0.5 mg or more and 8 mg or less, the coefficient of variation of the bead weight of the expanded beads is 10% or less, and the average value of the ratio of a long diameter to a short diameter (a long diameter/a short diameter) of the expanded beads measured with a projection image photographing type bead size distribution analyzer is 1 or more and 1.5 or less, the coefficient of variation of the ratio (a long diameter/a short diameter) is 12% or less, the average value of the a short diameter is 1 mm or more and 4 mm or less, and the coefficient of variation of the a short diameter is 10% or less.
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