公开(公告)号：US11051118B2

公开(公告)日：2021-06-29

申请号：US16538601

申请日：2019-08-12

Applicant: JVCKENWOOD Corporation

Inventor： Hiroshi Uchida ,  Hisako Murata ,  Takahiro Gejo ,  Yumi Fujii ,  Kuniaki Takachi ,  Masaya Konishi ,  Takayuki Uchida ,  Satoshi Yoshimura ,  Shuji Tanifuji

IPC: H04R29/00 ,  H04R1/08

Abstract: A sound pickup device according to this embodiment includes a microphone part placed at a sound pickup position in close proximity to an ear hole without blocking an ear canal, and positioned so as to face outside of the ear canal, and a wire having flexibility and extending to the sound pickup position. Further, in this embodiment, at least part of the wire is formed along an auricle.

公开(公告)号：US12004924B2

公开(公告)日：2024-06-11

申请号：US17030719

申请日：2020-09-24

Applicant: JVCKENWOOD Corporation

Inventor： Toshiyuki Himuro ,  Hiroshi Uchida

IPC: A61F11/14 ,  H04R1/10

CPC classification number: A61F11/14 ,  H04R1/10 ,  H04R2201/10

Abstract: Earmuffs include a bowl-shaped housing base having a first engagement portion, an annular plate-shaped base plate having a second engagement portion on one side and a third engagement portion on the other side, and is integrated with the housing base by causing the second engagement portion to be engaged with the first engagement portion, and a pad portion that includes a pad fixed on one side and a pad base having a fourth engagement portion on the other side, and is integrated with the base plate by causing the fourth engagement portion to be engaged with the third engagement portion. The base plate has a groove portion adjacent to the third engagement portion and the pad base has a rib that enters the groove portion. The rib enters the groove portion and restricts an inclination of the third engagement portion involved with an engagement with the fourth engagement portion.