公开(公告)号：US12020656B2

公开(公告)日：2024-06-25

申请号：US18217803

申请日：2023-07-03

Applicant: Japan Display Inc.

Inventor： Takaya Hirose ,  Hirofumi Ohira ,  Makoto Ishikawa

IPC: G09G3/34 ,  G09G3/36

CPC classification number: G09G3/3426 ,  G09G3/3648 ,  G09G2300/023 ,  G09G2320/0233 ,  G09G2320/0276 ,  G09G2320/0626 ,  G09G2320/0686

Abstract: According to an aspect, a display device includes: a display panel having a display area including pixels; a light source device configured to emit light from an emission area overlapping the display area toward the display panel; a dimming panel between the display panel and the light source device and configured to adjust brightness of emission light emitted from the emission area; and a drive circuit configured to drive the dimming panel. The emission area has a first emission area and a second emission area. The drive circuit is configured to, when gradation values of first pixels corresponding to the first emission area are equal to gradation values of second pixels corresponding to the second emission area, make transmittance of a second dimming area corresponding to the second pixels higher than that of a first dimming area corresponding to the first pixels in the dimming area.

公开(公告)号：US09111809B2

公开(公告)日：2015-08-18

申请号：US13748109

申请日：2013-01-23

Applicant: Japan Display Inc.

Inventor： Shunpei Takeuchi ,  Akio Ota ,  Manabu Mizuno ,  Takaya Hirose

IPC: H01L27/12 ,  H01L27/146 ,  H01L27/15 ,  H01L21/768 ,  H01L27/32

CPC classification number: H01L27/1248 ,  H01L21/76804 ,  H01L21/76835 ,  H01L27/1214 ,  H01L27/124 ,  H01L27/14603 ,  H01L27/15 ,  H01L27/3248

Abstract: A circuit substrate includes, on an insulating substrate, a plurality of devices, a plurality of conductive layers connected in one-to-one correspondence with the devices, and an insulating layer provided between the devices and the conductive layers. The insulating layer includes a first insulating layer covering the devices, a second insulating layer formed on the first insulating layer, and a plurality of contact holes each passing through the first and second insulating layers in a thickness direction thereof. Side surfaces of the first and second insulating layers contact each other in at least part of the inside of each contact hole. Each conductive layer extends along an upper surface of the second insulating layer, at least a part of a side surface of the contact hole in which the side surfaces of the first and second insulating layers contact each other, and a bottom surface of the contact hole.

Abstract translation: 电路基板在绝缘基板上包括多个器件，与器件一一对应连接的多个导电层以及设置在器件与导电层之间的绝缘层。 绝缘层包括覆盖器件的第一绝缘层，形成在第一绝缘层上的第二绝缘层，以及沿厚度方向穿过第一绝缘层和第二绝缘层的多个接触孔。 第一和第二绝缘层的侧表面在每个接触孔的内部的至少一部分中彼此接触。 每个导电层沿着第二绝缘层的上表面延伸，接触孔的侧表面的至少一部分，其中第一和第二绝缘层的侧表面彼此接触，并且接触孔的底表面 。