摘要:
An electronic device may be provided with a display cover layer mounted to the device using an adhesive bond with a display. The display may be a flexible display. The flexible display may include Organic Light Emitting Diode display technology. The display may be mounted to a rigid support structure. The rigid support structure may be mounted to a device housing member. Mounting the display cover layer to the display may eliminate the need to mount the display cover layer to the device housing and may allow active display pixels to be visible under the display cover layer closer to the device housing than in conventional devices. Providing the electronic device with active display pixels closer to the device housing may reduce the need for an inactive border around the display and may improve the aesthetic appeal of the electronic device.
摘要:
An electronic device may be provided with a display cover layer mounted to the device using an adhesive bond with a display. The display may be a flexible display. The flexible display may include Organic Light Emitting Diode display technology. The display may be mounted to a rigid support structure. The rigid support structure may be mounted to a device housing member. Mounting the display cover layer to the display may eliminate the need to mount the display cover layer to the device housing and may allow active display pixels to be visible under the display cover layer closer to the device housing than in conventional devices. Providing the electronic device with active display pixels closer to the device housing may reduce the need for an inactive border around the display and may improve the aesthetic appeal of the electronic device.
摘要:
An electronic device may have a display with a bent portion such as one or more bent edge portions. The display may be formed from a flexible display layer such as an organic light-emitting-diode layer. The organic light-emitting-diode layer may include a substrate layer such as a sheet of polymer. The flexible display may be attached to a support structure such as a flexible support layer using adhesive. To facilitate bending, the display may be heated. Bending and heating equipment may simultaneously heat the display layer and the flexible support layer to form a bent edge portion for the display. The bending and heating equipment may include heated structures for pressing the display layer into a desired shape.
摘要:
An electronic device may have a display with a bent portion such as one or more bent edge portions. The display may be formed from a flexible display layer such as an organic light-emitting-diode layer. The organic light-emitting-diode layer may include a substrate layer such as a sheet of polymer. The flexible display may be attached to a support structure such as a flexible support layer using adhesive. To facilitate bending, the display may be heated. Bending and heating equipment may simultaneously heat the display layer and the flexible support layer to form a bent edge portion for the display. The bending and heating equipment may include heated structures for pressing the display layer into a desired shape.
摘要:
An electronic device may be provided with a display and a multi-layer printed circuit. Integrated circuits and other components may be mounted to the multi-layer printed circuit. The display and multi-layer printed circuit may share a common layer formed from a flexible substrate. The flexible substrate may have portions that are integrated into the display and portions that are integrated into the multi-layer printed circuit board. The flexible substrate may contain patterned conductive traces that are used to route signals from components in the multi-layer printed circuit to display circuitry such as a display driver integrated circuit. An array of thin-film transistors may be used to control the emission of light from the display and may be formed on portions of the flexible substrate that are integrated into the display. The display may be a flexible display that includes an array of organic light-emitting diodes.
摘要:
An electronic device may have a display. The display may have an active region in which display pixels are used to display images. The display may have one or more openings and may be mounted in a housing associated with the electronic device. An electronic component may be mounted in alignment with the openings in the display. The electronic component may include a camera, a light sensor, a light-based proximity sensor, status indicator lights, a light-based touch sensor array, a secondary display that has display pixels that may be viewed through the openings, antenna structures, a speaker, a microphone, or other acoustic, electromagnetic, or light-based component. One or more openings in the display may form a window through which a user of the device may view an external object. Display pixels in the window region may be used in forming a heads-up display.
摘要:
Electronic devices that contain flexible displays and one or more display-based speaker structures may be provided. The speaker structures may be positioned under the flexible display. Portions of the flexible display may be used as speaker membranes for the speaker structures. The speaker structures may be driven by transducers that convert electrical audio signal input into sound. Piezoelectric transducers or transducers formed from coils and magnets may be used to drive the speaker structures. Speaker membranes may be formed from active display areas of the flexible display. Some, all, or substantially all of the flexible display may be used as a speaker membrane for one or more display-based speaker structures. An optional cover layer may be provided with speaker openings so that sound may pass from the display-based speaker structures to the exterior of the device.
摘要:
An electronic device may have a display. The display may have an active region in which display pixels are used to display images. The display may have one or more openings and may be mounted in a housing associated with the electronic device. An electronic component may be mounted in alignment with the openings in the display. The electronic component may include a camera, a light sensor, a light-based proximity sensor, status indicator lights, a light-based touch sensor array, a secondary display that has display pixels that may be viewed through the openings, antenna structures, a speaker, a microphone, or other acoustic, electromagnetic, or light-based component. One or more openings in the display may form a window through which a user of the device may view an external object. Display pixels in the window region may be used in forming a heads-up display.
摘要:
An electronic device may be provided with a display and a multi-layer printed circuit. Integrated circuits and other components may be mounted to the multi-layer printed circuit. The display and multi-layer printed circuit may share a common layer formed from a flexible substrate. The flexible substrate may have portions that are integrated into the display and portions that are integrated into the multi-layer printed circuit board. The flexible substrate may contain patterned conductive traces that are used to route signals from components in the multi-layer printed circuit to display circuitry such as a display driver integrated circuit. An array of thin-film transistors may be used to control the emission of light from the display and may be formed on portions of the flexible substrate that are integrated into the display. The display may be a flexible display that includes an array of organic light-emitting diodes.
摘要:
An electronic device may be provided with a display having a thin-film transistor layer. One or more holes in the thin-film transistor layer may be used to form pathways from display circuitry to other circuitry underneath the display. One or more conductive bridges may pass through holes in the thin-film transistor layer and may have one end that couples to the display circuitry and a second end that couples to a printed circuit underneath the display. These conductive bridges may be formed from wire bonding. Wire bond connections may be encapsulated with potting material to improve the reliability of the wire bond and increase the resiliency of the display. Display signal lines may be routed through holes in a thin-film transistor layer to run along a backside of the display thereby reducing the need for space in the border region for display circuitry.