公开(公告)号：US10784113B2

公开(公告)日：2020-09-22

申请号：US15773904

申请日：2016-08-08

Applicant: KCTECH CO., LTD.

Inventor： Kyunam Park

IPC: H01L21/304 ,  H01L21/306 ,  H01L21/67 ,  H01L21/02 ,  C09G1/02 ,  B24B37/12 ,  B24B37/20

Abstract: Provided are a chemical mechanical polishing apparatus and a control method thereof. The chemical mechanical polishing apparatus includes a plurality of polishing platens provided with a polishing pad on an upper surface thereof, and a polishing platen transferring unit for transferring the plurality of polishing platens to different process positions according to a predetermined process sequence. Here, different processes are performed at different process positions.