公开(公告)号：US20220274264A1

公开(公告)日：2022-09-01

申请号：US17583624

申请日：2022-01-25

Applicant: KCTECH CO., LTD.

Inventor： Moon Gi Cho ,  Hee Sung Chae ,  Seung Eun Lee ,  Geun Sik Yun

IPC: B25J15/00 ,  B65G49/06

Abstract: A substrate transferring system may include a first transfer unit to transfer a substrate along a circular first orbit while rotating on a first axis perpendicular to a ground, and a second transfer unit to transfer a substrate along a circular second orbit while rotating on a second axis perpendicular to the ground, wherein the first orbit and the second orbit may overlap with each other at a first point, and at the first point, a substrate may be transferred from the first transfer unit to the second transfer unit or from the second transfer unit to the first transfer unit.

公开(公告)号：US20220277963A1

公开(公告)日：2022-09-01

申请号：US17575913

申请日：2022-01-14

Applicant: KCTech Co., Ltd.

Inventor： Hee Sung Chae ,  Seung Eun Lee ,  Geun Sik Yun

IPC: H01L21/306 ,  H01L21/687 ,  H01L21/67 ,  H01L21/677 ,  H01L21/673

Abstract: A substrate polishing system may include a substrate transfer unit comprising a shaft to rotate on a rotation axis perpendicular to a ground and at least one transfer arm to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit by rotation of the shaft, and at least one carrier to perform polishing the substrate transferred by the substrate transfer unit.

公开(公告)号：US12186900B2

公开(公告)日：2025-01-07

申请号：US17671259

申请日：2022-02-14

Applicant: KCTECH CO., LTD.

Inventor： Hee Sung Chae ,  Seung Eun Lee ,  Geun Sik Yun

IPC: B25J9/04 ,  B25J11/00 ,  B65G61/00

Abstract: A substrate cleaning line and a substrate cleaning system including the same are disclosed. The substrate cleaning line may include a chamber portion including a plurality of cleaning chambers to clean a substrate, and a first return robot to load, unload, or transfer the substrate from or to the plurality of cleaning chambers, wherein the cleaning chambers may be stacked on each other in a vertical direction.

公开(公告)号：US20230061965A1

公开(公告)日：2023-03-02

申请号：US17671053

申请日：2022-02-14

Applicant: KCTECH CO., LTD.

Inventor： Hee Sung Chae ,  Seung Eun Lee ,  Geun Sik Yun

IPC: H01L21/677 ,  B08B13/00 ,  B25J15/00 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate treatment line is disclosed. The substrate treatment line may include a chamber portion including a plurality of treatment chambers stacked in a vertical direction, and a vertical return robot, including a plurality of gripping portions, to transfer a plurality of substrates in a vertical direction simultaneously and load or unload the substrates to the treatment chambers.