Image-based overlay metrology and monitoring using through-focus imaging

    公开(公告)号:US10817999B2

    公开(公告)日:2020-10-27

    申请号:US16034093

    申请日:2018-07-12

    Abstract: A metrology system includes a controller coupled to a detector to image a sample based on the light captured by an objective lens, where an object plane of the detector with respect to the sample is adjustable. The controller may direct the detector to generate reference images of an overlay target on the sample at multiple object planes including at least a first reference image at a first sample layer and a second reference image at a second sample layer. The controller may further determine a reference overlay between the first layer and the second layer at the overlay target based on the first reference image and the second reference image. The controller may further select a measurement object plane for single-image overlay determination that corresponds to the reference overlay within a selected tolerance. The controller may further determine overlay for additional overlay targets at the measurement plane.

    UTILIZING OVERLAY MISREGISTRATION ERROR ESTIMATIONS IN IMAGING OVERLAY METROLOGY

    公开(公告)号:US20190122357A1

    公开(公告)日:2019-04-25

    申请号:US15739381

    申请日:2017-10-22

    Abstract: Systems and methods are provided, which calculate overlay misregistration error estimations from analyzed measurements of each ROI (region of interest) in at least one metrology imaging target, and incorporate the calculated overlay misregistration error estimations in a corresponding estimation of overlay misregistration. Disclosed embodiments provide a graduated and weighted analysis of target quality which may be integrated in a continuous manner into the metrology measurement processes, and moreover evaluates target quality in terms of overlay misregistration, which forms a common basis for evaluation of errors from different sources, such as characteristics of production steps, measurement parameters and target characteristics. Such common basis then enables any of combining various error sources to give a single number associated with measurement fidelity, analyzing various errors at wafer, lot and process levels, and/or to trade-off the resulting accuracy for throughput by reducing the number of measurements, in a controlled manner.

    Hybrid Overlay Target Design for Imaging-Based Overlay and Scatterometry-Based Overlay

    公开(公告)号:US20180364179A1

    公开(公告)日:2018-12-20

    申请号:US15995731

    申请日:2018-06-01

    Inventor: David Gready

    Abstract: Designs for a hybrid overlay target design that includes a target area with both an imaging-based target and a scatterometry-based target are disclosed. The imaging-based overlay target design can include side-by-side grating structure. A scatterometry-based overlay target design at a different location in the target area can include grating-over-grating structure. A method of measuring the hybrid overlay target design and a system with both an imaging optical system and a scatterometry system for measuring the hybrid overlay target design are also disclosed.

    TARGET AND PROCESS SENSITIVITY ANALYSIS TO REQUIREMENTS
    5.
    发明申请
    TARGET AND PROCESS SENSITIVITY ANALYSIS TO REQUIREMENTS 审中-公开
    目标和过程灵敏度分析要求

    公开(公告)号:US20160042105A1

    公开(公告)日:2016-02-11

    申请号:US14919954

    申请日:2015-10-22

    Abstract: Systems and method are provided for analyzing target, process and metrology configuration sensitivities to a wide range of parameters, according to external requirements or inner development and verification needs. Systems comprise the following elements. An input module is arranged to receive parameters relating to targets, target metrology conditions and production processes, to generate target data. A metrology simulation unit is arranged to simulate metrology measurements of targets from the target data and to generate multiple metrics that quantify the simulated target measurements. A sensitivity analysis module is arranged to derive functional dependencies of the metrics on the parameters and to define required uncertainties of the parameters with respect to the derived functional dependencies. Finally, a target optimization module is arranged to rank targets and target metrology conditions with respect to the simulated target measurements.

    Abstract translation: 提供系统和方法,根据外部要求或内部开发和验证需求,将目标,过程和度量配置灵敏度分析到广泛的参数。 系统包括以下要素。 输入模块被布置成接收与目标相关的参数,目标计量条件和生产过程,以产生目标数据。 计量模拟单元被设置为模拟来自目标数据的目标的度量测量并且生成量化模拟目标测量的多个度量。 灵敏度分析模块被布置为导出度量对参数的功能依赖性并且相对于导出的功能依赖性来定义参数的所需不确定性。 最后,设置目标优化模块以对目标和目标计量条件进行相对于模拟目标测量的排序。

    Target and process sensitivity analysis to requirements

    公开(公告)号:US10726169B2

    公开(公告)日:2020-07-28

    申请号:US14919954

    申请日:2015-10-22

    Abstract: Systems and method are provided for analyzing target, process and metrology configuration sensitivities to a wide range of parameters, according to external requirements or inner development and verification needs. Systems comprise the following elements. An input module is arranged to receive parameters relating to targets, target metrology conditions and production processes, to generate target data. A metrology simulation unit is arranged to simulate metrology measurements of targets from the target data and to generate multiple metrics that quantify the simulated target measurements. A sensitivity analysis module is arranged to derive functional dependencies of the metrics on the parameters and to define required uncertainties of the parameters with respect to the derived functional dependencies. Finally, a target optimization module is arranged to rank targets and target metrology conditions with respect to the simulated target measurements.

    Utilizing overlay misregistration error estimations in imaging overlay metrology

    公开(公告)号:US10565697B2

    公开(公告)日:2020-02-18

    申请号:US15739381

    申请日:2017-10-22

    Abstract: Systems and methods are provided, which calculate overlay misregistration error estimations from analyzed measurements of each ROI (region of interest) in at least one metrology imaging target, and incorporate the calculated overlay misregistration error estimations in a corresponding estimation of overlay misregistration. Disclosed embodiments provide a graduated and weighted analysis of target quality which may be integrated in a continuous manner into the metrology measurement processes, and moreover evaluates target quality in terms of overlay misregistration, which forms a common basis for evaluation of errors from different sources, such as characteristics of production steps, measurement parameters and target characteristics. Such common basis then enables any of combining various error sources to give a single number associated with measurement fidelity, analyzing various errors at wafer, lot and process levels, and/or to trade-off the resulting accuracy for throughput by reducing the number of measurements, in a controlled manner.

    Image-Based Overlay Metrology and Monitoring Using Through-Focus Imaging

    公开(公告)号:US20190026885A1

    公开(公告)日:2019-01-24

    申请号:US16034093

    申请日:2018-07-12

    Abstract: A metrology system includes a controller coupled to a detector to image a sample based on the light captured by an objective lens, where an object plane of the detector with respect to the sample is adjustable. The controller may direct the detector to generate reference images of an overlay target on the sample at multiple object planes including at least a first reference image at a first sample layer and a second reference image at a second sample layer. The controller may further determine a reference overlay between the first layer and the second layer at the overlay target based on the first reference image and the second reference image. The controller may further select a measurement object plane for single-image overlay determination that corresponds to the reference overlay within a selected tolerance. The controller may further determine overlay for additional overlay targets at the measurement plane.

Patent Agency Ranking