公开(公告)号：US20160268156A1

公开(公告)日：2016-09-15

申请号：US15065430

申请日：2016-03-09

Applicant: KLA-TENCOR CORPORATION

Inventor： Pradeep Subrahmanyan ,  Luping HUANG ,  Chris POHLHAMMER

IPC: H01L21/683

CPC classification number: H01L21/6838 ,  H01L21/67288

Abstract: An apparatus tor fixing a wafer, including a chuck having a surface, a plurality of through bores in the chuck extending through the surface of the chuck, a fixed vacuum bellows, and a plurality of floating air bearings, wherein the fixed vacuum bellows and a respective floating air bearing of the plurality of floating air bearings are each individually arranged in separate through bores of the plurality of through bores and elevationally above the surface of the chuck.

Abstract translation: 一种固定晶片的装置，包括具有表面的卡盘，在卡盘中延伸穿过卡盘表面的多个通孔，固定的真空波纹管和多个浮动空气轴承，其中固定的真空波纹管和 多个浮动空气轴承的各自的浮动空气轴承各自分别布置在多个通孔的分开的通孔中并且在卡盘的表面上方。

公开(公告)号：US20160163580A1

公开(公告)日：2016-06-09

申请号：US14683555

申请日：2015-04-10

Applicant: KLA-TENCOR CORPORATION

Inventor： Luping HUANG

IPC: H01L21/683 ,  F16J3/04 ,  B25B11/00

CPC classification number: H01L21/6838 ,  B25B11/005 ,  F16J3/047 ,  H01L21/68785

Abstract: A vacuum chuck has at least one suction assembly that pulls a wafer surface toward a chucking surface. The suction assembly may be used with a wafer that is warped. A suction force engages a pad of a suction assembly with the wafer surface and retracts a bellows of the suction assembly. As the bellows retracts and draws the wafer surface closer to the chucking surface, the suction force provided by the vacuum chuck can pull the wafer flat.

Abstract translation: 真空吸盘具有至少一个抽吸组件，其将晶片表面拉向卡盘表面。 抽吸组件可以与翘曲的晶片一起使用。 抽吸力将抽吸组件的垫与晶片表面接合并缩回抽吸组件的波纹管。 当波纹管缩回并将晶片表面拉近到卡盘表面时，由真空卡盘提供的吸力可以使晶片平坦。